IP Library Granted Patent US 9,524,982
Granted Patent B2
US 9,524,982 · App. 14/827,495 · Granted Dec 20, 2016

Semiconductor device

Inventor: Takeshi Kamigaichi (Yokkaichi, JP)
Assignee: Kabushiki Kaisha Toshiba
H01L27/11582H01L27/11565H01L29/41741H01L29/4234H01L27/11556
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Quick Facts
Patent No.
US 9,524,982
App. No.
14/827,495
Granted
Dec 20, 2016
Kind
B2
Abstract

According to one embodiment, the semiconductor body of the first portion includes a first semiconductor part and a second semiconductor part. The first semiconductor part extends in the stacking direction. The second semiconductor part is provided between the first semiconductor part and the first electrode layer, and has an end located closer to the first electrode layer side than the first semiconductor part. The first insulating film of the second portion includes a first insulating part and a second insulating part. The first insulating part extends in the stacking direction. The second insulating part is provided between the first insulating part and the second electrode layer, and has an end located closer to the second electrode layer side than the first insulating part.

Claims (56)

1. A semiconductor device comprising:

a stacked body including a plurality of electrode layers stacked with an insulator between the electrode layers; and

a columnar part including a semiconductor body, a charge storage film, a first insulating film, and a second insulating film, the semiconductor body extending in the stacked body in a stacking direction of the stacked body, the charge storage film provided between the semiconductor body and the electrode layers, the first insulating film provided between the semiconductor body and the charge storage film, the second insulating film provided between the charge storage film and the electrode layers,

the columnar part including a first portion having a first diameter, and a second portion having a second diameter smaller than the first diameter,

the electrode layers including a first electrode layer contiguous to the first portion, and a second electrode layer contiguous to the second portion and thinner than the first electrode layer,

the semiconductor body of the first portion including a first semiconductor part and a second semiconductor part, the first semiconductor part extending in the stacking direction, the second semiconductor part provided between the first semiconductor part and the first electrode layer, the second semiconductor part having an end located closer to the first electrode layer side than the first semiconductor part, and

the first insulating film of the second portion including a first insulating part and a second insulating part, the first insulating part extending in the stacking direction, the second insulating part provided between the first insulating part and the second electrode layer, the second insulating part having an end located closer to the second electrode layer side than the first insulating part.

2. The device according to claim 1 , wherein

the insulator is an insulating layer,

steps are formed between a side surface of the first electrode layer on the columnar part side and a side surface of the insulating layer on the columnar part side, and

the charge storage film and the first insulating film of the first portion of the columnar part are conformally provided along the steps.

3. The device according to claim 1 , wherein the second semiconductor part of the semiconductor body is provided in a ring shape around the first semiconductor part.

4. The device according to claim 1 , wherein

the insulator is an insulating layer,

steps are formed between a side surface of the second electrode layer on the columnar part side and a side surface of the insulating layer on the columnar part side, and

the charge storage film of the second portion of the columnar part is conformally provided along the steps.

5. The device according to claim 1 , wherein the second insulating part of the first insulating film is provided in a ring shape around the first insulating part.

6. The device according to claim 1 , wherein a thickness of a part in which the second insulating part of the first insulating film is provided in the second portion of the columnar part in a direction connecting the second electrode layer and the semiconductor body is larger than a thickness of the first insulating film in the first portion of the columnar part.

7. The device according to claim 1 , wherein

the first portion of the columnar part is provided at an upper side of a center part in the stacking direction, and

the second portion of the columnar part is provided at a lower side of the center part in the stacking direction.

8. The device according to claim 1 , wherein a side surface of the semiconductor body on the first insulating film side of the second portion of the columnar part extends along the stacking direction.

9. The device according to claim 1 , wherein the second insulating film is also provided between the first electrode layer and the insulator, and between the second electrode layer and the insulator.

10. A semiconductor device comprising:

a stacked body including a plurality of electrode layers stacked with an insulator between the electrode layers; and

a columnar part including a semiconductor body, a charge storage film, a first insulating film, and a second insulating film, the semiconductor body extending in the stacked body in a stacking direction of the stacked body, the charge storage film provided between the semiconductor body and the electrode layers, the first insulating film provided between the semiconductor body and the charge storage film, the second insulating film provided between the charge storage film and the electrode layers,

the columnar part including a first portion having a first diameter, and a second portion having a second diameter smaller than the first diameter,

the electrode layers including a first electrode layer contiguous to the first portion, and a second electrode layer contiguous to the second portion,

a distance between the second electrode layer and the semiconductor body being larger than a distance between the first electrode layer and the semiconductor body, and

the first insulating film of the second portion including a first insulating part and a second insulating part, the first insulating part extending in the stacking direction, the second insulating part provided between the first insulating part and the second electrode layer, the second insulating part having an end located closer to the second electrode layer side than the first insulating part.

11. The device according to claim 10 , wherein

the insulator is an insulating layer,

steps are formed between a side surface of the second electrode layer on the columnar part side and a side surface of the insulating layer on the columnar part side, and

the charge storage film of the second portion of the columnar part is conformally provided along the steps.

12. The device according to claim 10 , wherein the second insulating part of the first insulating film is provided in a ring shape around the first insulating part.

13. The device according to claim 10 , wherein a thickness of a part in which the second insulating part of the first insulating film is provided in the second portion of the columnar part in a direction connecting the second electrode layer and the semiconductor body is larger than a thickness of the first insulating film in the first portion of the columnar part.

14. The device according to claim 10 , wherein

the first portion of the columnar part is provided at an upper side of a center part in the stacking direction, and

the second portion of the columnar part is provided at a lower side of the center part in the stacking direction.

15. The device according to claim 10 , wherein a thickness of the first electrode layer and a thickness of the second electrode layer are nearly equal.

16. A semiconductor device comprising:

a stacked body including a plurality of electrode layers stacked with an insulator between the electrode layers; and

a columnar part including a semiconductor body, a charge storage film, a first insulating film, and a second insulating film, the semiconductor body extending in the stacked body in a stacking direction of the stacked body, the charge storage film provided between the semiconductor body and the electrode layers, the first insulating film provided between the semiconductor body and the charge storage film, the second insulating film provided between the charge storage film and the electrode layers,

the columnar part including a first portion having a first diameter, and a second portion having a second diameter smaller than the first diameter,

the electrode layers including a first electrode layer contiguous to the first portion, and a second electrode layer contiguous to the second portion,

the semiconductor body of the second portion having a side surface located at the first insulating film side, the side surface extending in the stacking direction, and

the semiconductor body of the first portion including a first semiconductor part and a second semiconductor part, the first semiconductor part extending in the stacking direction, the second semiconductor part provided between the first semiconductor part and the first electrode layer, the second semiconductor part having an end located closer to the first electrode layer side than the first semiconductor part.

17. The device according to claim 16 , wherein

the insulator is an insulating layer,

steps are formed between a side surface of the first electrode layer on the columnar part side and a side surface of the insulating layer on the columnar part side, and

the charge storage film and the first insulating film of the first portion of the columnar part are conformally provided along the steps.

18. The device according to claim 16 , wherein the second semiconductor part of the semiconductor body is provided in a ring shape around the first semiconductor part.

19. The device according to claim 16 , wherein

the first portion of the columnar part is provided at an upper side of a center part in the stacking direction, and

the second portion of the columnar part is provided at a lower side of the center part in the stacking direction.

20. The device according to claim 16 , wherein a thickness of the first electrode layer and a thickness of the second electrode layer are nearly equal.

Assignments (5)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 27, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043355/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2015
From: KAMIGAICHI, TAKESHI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 037002/0275 →
Continuity (2)
Provisional Application 62130159 · Mar 9, 2015
Related Publication 20160268293A1 · Sep 15, 2016