Apparatus and method for monitoring a package during transit
View Patent ↗According to one aspect, a monitoring device for detecting when an object may be subjected to a condition includes a processor, a sensor, and a configuration circuit. The sensor is adapted to detect if the object is subjected to at least a first magnitude of the particular condition. The configuration circuit may be used to specify a second magnitude of the particular condition, wherein the second magnitude is greater than the first magnitude. The processor remains in an inactive state if the object is subjected to a magnitude of the particular condition less than the second magnitude, and the sensor generates a signal in response to detection of object being subjected to at least the second magnitude of the particular condition. In response to the signal, the processor enters an active state to develop an indication of at least the second magnitude of the particular condition.
1. A monitoring device for detecting that an object has been subjected to a particular condition, comprising:
a carrier disposed on the object;
a processor disposed on the carrier;
a sensor disposed on the carrier, wherein the sensor is adapted to detect when the object is subjected to at least a first magnitude of the particular condition;
a configuration circuit for specifying a configuration parameter, wherein the configuration parameter includes a second magnitude of the particular condition, wherein the second magnitude is greater than the first magnitude, wherein the configuration circuit includes two conductive traces associated with the configuration parameter, wherein coupling the two conductive traces specifies the second magnitude;
wherein the two conductive traces are disposed between the carrier and a further carrier, and the coupling occurs through an aperture of the further carrier and wherein the processor remains in an inactive state if the object is subjected to a magnitude of the particular condition less than the second magnitude, the sensor generates a signal in response to detection of the object being subjected to a third magnitude of the particular condition, and in response to the signal the processor enters an active state to develop an indication of third magnitude of the particular condition, wherein the third magnitude is greater than or equal to the second magnitude.
2. The monitoring device of claim 1 , wherein the further carrier includes a further aperture and two further conductive traces; wherein the coupling of the two further conductive traces occurs through the further aperture, wherein the coupling of the two further conductive traces specifies a further configuration parameter.
3. A monitoring device for detecting that an object has been subjected to a particular condition, comprising:
a carrier disposed on the object;
a processor disposed on the carrier;
a sensor disposed on the carrier, wherein the sensor is adapted to detect when the object is subjected to at least a first magnitude of the particular condition;
a configuration circuit for specifying a configuration parameter, wherein the configuration parameter includes a second magnitude of the particular condition, wherein the second magnitude is greater than the first magnitude, wherein the configuration circuit includes two conductive traces that may be decoupled, and decoupling the two conductive traces specifies the second magnitude, wherein the monitoring device includes a further carrier having a removable tab, wherein removing the removable tab decouples the two conductive traces; and
wherein the processor remains in an inactive state if the object is subjected to a magnitude of the particular condition less than the second magnitude, the sensor generates a signal in response to detection of the object being subjected to a third magnitude of the particular condition, and in response to the signal the processor enters an active state to develop an indication of third magnitude of the particular condition, wherein the third magnitude is greater than or equal to the second magnitude.
4. The monitoring device of claim 3 , wherein the further carrier includes a further removable tab, wherein removing the further removable tab specifies a further configuration parameter.
5. The monitoring device of claim 3 , wherein the removable tab includes a surface having a conductive portion and the conductive portion couples the two conductive traces.
6. The monitoring device of claim 3 , wherein removing the removable tab generates a reset signal to the processor.
7. The monitoring device of claim 1 , further including a reset signal generator to generate a reset signal that actuates the monitoring device, and wherein the reset signal is generated when the two conductive traces are coupled.
8. The monitoring device of claim 1 , further including a reset signal generator to generate a reset signal that actuates the monitoring device, wherein the reset signal is generated when the two conductive traces are decoupled.
9. The monitoring device of claim 1 , wherein the carrier includes a switch, a memory, and one or more removable tabs, wherein actuation of the switch causes the processor to record the tabs that have been removed.
10. The monitoring device of claim 9 , wherein in response to actuation of the switch, the processor records in the memory a plurality of configuration parameters associated determined by the removed tabs.
11. The monitoring device of claim 9 , wherein in response to actuation of the switch, the processor records in the memory predefined configuration parameters when none of the removable tabs have been removed.
12. A method of detecting that an object has been subjected to a particular condition, comprising:
detecting when the object is subjected to at least a first magnitude of the particular condition;
specifying a configuration parameter, wherein the configuration parameter includes a second magnitude of the particular condition, wherein the second magnitude is greater than the first magnitude, wherein specifying the configuration parameter comprises a step of coupling two conductive traces of an electronic circuit;
wherein the step of coupling the two conductive traces includes the step of accessing the two coupling traces through an aperture in a carrier;
generating a signal in response to detection of the object being subjected to a third magnitude of the particular object;
operating a processor in an inactive state if the object is subjected to a magnitude of the particular condition less than the second magnitude; and
operating the processor in an active state to develop an indication of the third magnitude of the particular condition, wherein the third magnitude is greater than or equal to the second magnitude.
13. The method of claim 12 , wherein the step of specifying the configuration parameter includes the step of decoupling the two conductive traces of an electronic circuit.
14. The method of claim 13 , wherein the step of decoupling the two conductive traces includes a step of removing a removable tab from the carrier, wherein removing the removable tab is sufficient to decouples the two conductive traces.