EPOXY RESIN COMPOSITION, PREPREG USING THE EPOXY RESIN COMPOSITION, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
It is an object of the present invention to provide an epoxy resin composition containing an epoxy compound, a low-molecular-weight phenol-modified polyphenylene ether and a cyanate compound as essential components, the epoxy resin composition having excellent dielectric characteristics and exhibiting high heat resistance while maintaining flame retardancy. To achieve this, the epoxy resin composition of the present invention is a thermosetting resin composition composed of a resin varnish containing (A) an epoxy compound having a number-average molecular weight of 1000 or less and containing at least two epoxy groups in the molecule without containing any halogen atoms, (B) a polyphenylene ether having a number-average molecular weight of 5000 or less, (C) a cyanate ester compound, (D) a curing catalyst and (E) a halogen flame retardant, all of the components (A) to (C) are dissolved in the resin varnish, while component (E) is dispersed without being dissolved in the resin varnish.
1 . An epoxy resin composition which is a thermosetting resin composition composed of a resin varnish containing (A) an epoxy compound having a number-average molecular weight of 1000 or less and containing at least two epoxy groups in the molecule without containing any halogen atoms, (B) a polyphenylene ether having a number-average molecular weight of 5000 or less, (C) a cyanate ester compound, (D) a curing catalyst and (E) a halogen flame retardant,
wherein all of the components (A) to (C) are dissolved in the resin varnish, while the component (E) is dispersed without being dissolved in the resin varnish, and
said halogen flame retardant (E) is at least one kind selected from the group consisting of ethylene dipentabromobenzene, ethylene bistetrabromoimide, decabromodiphenyl oxide and tetradecabromodiphenoxy benzene.
2 . The epoxy resin composition according to claim 1 , wherein said halogen flame retardant (E) has a melting point of 300° C. or more.
3 . The epoxy resin composition according to claim 1 , wherein said epoxy compound (A) is at least one epoxy compound selected from dicyclopentadiene epoxy compounds, bisphenol F epoxy compounds, bisphenol A epoxy compounds and biphenyl epoxy compounds.
4 . The epoxy resin composition according to claim 1 , wherein said polyphenylene ether (B) is obtained by subjecting a polyphenylene ether with a number-average molecular weight of 10,000 to 30,000 to a redistribution reaction in a solvent in the presence of a phenol compound and a radical initiator.
5 . The epoxy resin composition according to claim 1 , wherein said curing catalyst (D) contains an organic metal salt.
6 . The epoxy resin composition according to claim 1 , wherein the epoxy resin composition further contains (F) an inorganic filler.
7 . The epoxy resin composition according to claim 6 , wherein the inorganic filler (F) is at least one kind selected from the group consisting of spherical silica, aluminum hydroxide and magnesium hydroxide.
8 . The epoxy resin composition according to claim 7 , wherein the inorganic filler (F) is spherical silica that has been treated with at least one kind of silane coupling agent selected from epoxysilane type silane coupling agents and aminosilane type silane coupling agents.
9 . A prepreg comprising a fiber substrate impregnated with the epoxy resin composition according to claim 1 .
10 . A metal-clad laminate comprising a cured product of the prepreg according to claim 9 , and a metal foil laminated on one or both surface(s) of the cured product.
11 . A printed wiring board comprising a cured product of the prepreg according to claim 9 , and a conductive pattern of circuits formed on a surface of the cured product.