Nonvolatile semiconductor memory device and method for manufacturing same
A nonvolatile semiconductor memory device, includes: a stacked structural unit including a plurality of insulating films alternately stacked with a plurality of electrode films in a first direction; a selection gate electrode stacked on the stacked structural unit in the first direction; an insulating layer stacked on the selection gate electrode in the first direction; a first semiconductor pillar piercing the stacked structural unit, the selection gate electrode, and the insulating layer in the first direction, a first cross section of the first semiconductor pillar having an annular configuration, the first cross section being cut in a plane orthogonal to the first direction; a first core unit buried in an inner side of the first semiconductor pillar, the first core unit being recessed from an upper face of the insulating layer; and a first conducting layer of the first semiconductor pillar provided on the first core unit to contact the first core unit.
1. A nonvolatile semiconductor memory device, comprising:
a stacked structural unit including a plurality of electrode films stacked in a first direction;
a first selection gate electrode stacked above the stacked structural unit in the first direction;
a first pillar including a first semiconductor pillar and an first insulating layer, the first pillar piercing the stacked structural unit and the first selection gate electrode in the first direction, the first insulating layer being provided on an inner side of the first semiconductor pillar;
a first contact plug provided above the first selection gate electrode, the first contact plug being electrically connected to the first semiconductor pillar; and
a first conductive layer provided on an inner surface of the first semiconductor pillar, a position of a lower end of the first conductive layer in the first direction being located above a position of an upper end of the first selection gate electrode in the first direction, the first conductive layer being electrically connected to the first contact plug.
2. The device according to claim 1 , wherein:
the position of the lower end of the first conductive layer is located below a lower end of the first contact plug in the first direction.
3. The device according to claim 1 , further comprising:
a charge storage layer provided between the first semiconductor pillar and the electrode films;
a first insulating film provided between the electrode films and the charge storage layer; and
a second insulating unit provided between the semiconductor pillar and the charge storage layer.
4. The device according to claim 1 , further comprising:
a second selection gate electrode stacked above the stacked structural unit in the first direction;
a second pillar including a second semiconductor pillar and a second insulating layer, the second pillar piercing the stacked structural unit and the second selection gate electrode in the first direction, the second insulating layer being provided inside of the second semiconductor pillar;
a second contact plug provided above the second selection gate electrode, the second contact plug being electrically connected to the second semiconductor pillar; and
a second conductive layer provided on an inner surface of the second semiconductor pillar, a position of a lower end of the second conductive layer in the second direction being located between a position of a lower end of the second contact plug in the first direction and a position of an upper end of the second selection gate electrode in the first direction, the second conductive layer being electrically connected to the second contact plug.
5. The device according to claim 1 , further comprising:
a connection portion connecting the first semiconductor pillar and the second semiconductor pillar on a side opposite to the first and second selection gates.
6. The device according to claim 1 , wherein the first conducting layer includes polysilicon and an impurity added to the polysilicon.
7. The device according to claim 1 , wherein the stacked structural unit includes a plurality of insulating films, the plurality of electrode films and the plurality of insulating films being alternately stacked.
8. The device according to claim 1 , wherein the first semiconductor pillar includes at least one selected from polysilicon and amorphous silicon.
9. The device according to claim 1 , wherein the first insulating layer includes silicon nitride.
10. A nonvolatile semiconductor memory device, comprising:
a plurality of electrode films stacked in a first direction, the electrode film being a part of a cell transistor;
a first selection gate electrode stacked above the plurality of electrode films in the first direction;
a first pillar including a first semiconductor pillar and a first insulating layer, the first pillar piercing the plurality of electrode films and the first selection gate electrode in the first direction, the first insulating layer being provided on an inner side of the first semiconductor pillar;
a first contact plug provided above the first selection gate electrode, the first contact plug being electrically connected to the first semiconductor pillar; and
a first conductive layer provided on an inner surface of the first semiconductor pillar, a position of a lower end of the first conductive layer in the first direction being located above a position of an upper end of the first selection gate electrode in the first direction, the first conductive layer being electrically connected to the first contact plug.
11. The device according to claim 10 , wherein:
the position of the lower end of the first conductive layer is located below a lower end of the first contact plug in the first direction.
12. The device according to claim 10 , further comprising:
a charge storage layer provided between the first semiconductor pillar and the electrode films;
a first insulating film provided between the electrode films and the charge storage layer; and
a second insulating unit provided between the semiconductor pillar and the charge storage layer.
13. The device according to claim 10 , further comprising:
a second selection gate electrode stacked above the plurality of electrode films in the first direction;
a second pillar including a second semiconductor pillar and a second insulating layer, the second pillar piercing the plurality of electrode films and the second selection gate electrode in the first direction, the second insulating layer being provided inside of the second semiconductor pillar;
a second contact plug provided above the second selection gate electrode, the second contact plug being electrically connected to the second semiconductor pillar; and
a second conductive layer provided on an inner surface of the second semiconductor pillar, a position of a lower end of the second conductive layer in the second direction being located between a position of a lower end of the second contact plug in the first direction and a position of an upper end of the second selection gate electrode in the first direction, the second conductive layer being electrically connected to the second contact plug.
14. The device according to claim 10 , further comprising:
a connection portion connecting the first semiconductor pillar and the second semiconductor pillar on a side opposite to the first and second selection gates.
15. The device according to claim 10 , wherein the first conducting layer includes polysilicon and an impurity added to the polysilicon.
16. The device according to claim 10 , further comprising a plurality of insulating films, the plurality of electrode films and the plurality of insulating films being alternately stacked.
17. The device according to claim 10 , wherein the first semiconductor pillar includes at least one selected from polysilicon and amorphous silicon.
18. The device according to claim 10 , wherein the first insulating layer includes silicon nitride.