Injection-molded circuit carrier
View Patent ↗An injection-molded circuit carrier is provided that has an outside and an underside and an inner base region and a frame. The frame has an inside and a cover surface, so that the inner base region is enclosed in the manner of a frame, and multiple printed conductors are provided, which are spaced a distance apart. The printed conductors are guided at least partially from the inside to the underside via the cover surface and via the outside so that at least two metal surfaces are formed on the underside, which are each electrically connected to a printed conductor and are spaced a distance apart. The metal surfaces are designed to be significantly wider than the printed conductors for the purpose of forming a capacitive sensor.
1. A capacitive sensor comprising:
an injection-molded circuit carrier, comprising:
an outside region;
an underside region;
an inner base region enclosed by a frame;
the frame having an inside surface, a cover surface and an outside; and
a plurality of printed conductors, which are spaced a distance apart, being guided from the inside surface to an underside via the cover surface and via the outside; and
a semiconductor body being disposed on the base region, the semiconductor body including an integrated circuit, the integrated circuit being electrically operatively connected with the aid of the printed conductors,
wherein the frame has a quadrilateral and circumferentially enclosed design, and the semiconductor body is designed in the form of a die, and trough-shaped formation is filled with a casting compound so that the semiconductor body is protected to the greatest extent against environmental influences after casting;
wherein the integrated circuit is electrically operatively connected to sensor surfaces on the underside; and
at least two sensor surfaces that are each electrically connected to the printed conductor and are spaced a distance apart and are arranged on an underside being wider than the printed conductors to form the capacitive sensor.
2. The capacitive sensor according to claim 1 , wherein the surface of the casting compound forms a planar surface with the cover surface of the frame.
3. The capacitive sensor according to claim 1 , wherein the sensor surfaces and the assigned printed conductors form a single piece.
4. The capacitive sensor according to claim 1 , wherein four metal surfaces, which are spaced a distance apart, are formed on the underside.
5. The capacitive sensor according to claim 1 , wherein the sensor surfaces are part of a circle.
6. The capacitive sensor according to claim 1 , wherein the sensor surfaces are electrically insulated from each other.
7. The capacitive sensor according to claim 1 , wherein contact surfaces designed as semiconductor bodies are connected to the printed conductors with the aid of bond wires or with the aid of a flip connection and are electrically operatively connected hereby to the sensor surfaces on the underside.
8. The capacitive sensor according to claim 7 , wherein a height of the frame is greater than a thickness of the semiconductor body.