Use of combined masking techniques and/or combined material removal techniques to protectively coat electronic devices
Processes for masking electronic devices, including, but not limited to, electronic subassemblies, prior to the application of protective coatings to the electronic devices are disclosed. Such processes include the use of a plurality of different masking techniques in combination to mask the electronic device. Different masking techniques may be used to mask different features and/or components of the electronic device. Some features and/or components may be masked by way of two or more masking techniques. With one or more masks in place, an electronic device may be protectively coated. After a protective coating has been applied to the electronic device, at least a portion of the mask(s) may be removed from the electronic device. Protectively coated electronic devices may then be assembled with one another.
1. A method for applying a protective coating to an electronic device, comprising:
applying a protective coating to selected areas of an electronic device comprising features and components, wherein applying the protective coating to the selected areas of the electronic device comprises masking the electronic device in areas of the electronic device other than the selected areas, coating the electronic device and de-masking the electronic device,
wherein the masking the electronic device includes:
applying flat preformed elements to flat features and/or components of the electronic device;
applying a fluid masking material to at least some of the features and/or the components of the electronic device that protrude from the electronic device: and
applying a non-hardenable semisolid masking material around at least one of said components that protrudes from a daughter board of the electronic device and/or within a receptacle of at least one of the components carried by the electronic device.
2. The method of claim 1 , further comprising applying a second protective coating to selected areas of a motherboard of the electronic device, wherein applying the second protective coating to selected areas of the motherboard comprises masking the motherboard, coating the motherboard and de masking the motherboard.
3. The method of claim 2 , wherein masking the motherboard includes applying a fluid masking material to at least one electrical connector carried by the motherboard.
4. The method of claim 1 , further comprising applying a third protective coating to selected areas of the daughter board of the electronic device, wherein applying the third protective coating to selected areas of the daughter board comprises masking the daughter board, coating the daughter board and de-masking the daughter board.
5. The method of claim 4 , wherein masking the daughter board includes applying flat preformed elements to flat features and/or components of the daughterboard and applying a fluid masking material to at least some features and/or components that protrude from the daughter board.
6. The method of claim 5 , wherein masking the daughter board further includes applying a non-hardenable semisolid masking material around at least one component that protrudes from the daughter board and/or within a receptacle of at least one component carried by the daughter board.
7. The method of claim 1 , wherein applying the non-hardenable semisolid masking material comprises applying the non-hardenable semisolid masking material to a zero insertion force connector.
8. The method of claim 1 , further comprising applying a fourth protective coating to selected areas of a flexible printed circuit connector of the electronic device, wherein applying the fourth protective coating to selected areas of the flexible printed circuit connector comprises masking the flexible printed circuit connector, coupling the flexible printed circuit connector to a complementary element of an electrical connector, and coating the flexible printed circuit connector and the complementary element.