Embossing tool and methods of preparation
View Patent ↗The present invention is directed to an embossing tool having a microstructure on its surface wherein the surface of the embossing tool has a thin layer of gold or an alloy thereof. Such an embossing tool not only can reduce adhesion between the surface of the embossing tool and a cured material, but also does not cause any significant change to the profile of the microstructure.
1. A method for preparing an embossing tool comprising:
i) coating a photoresist material on a substrate;
ii) exposing the photoresist material to a light source;
iii) removing the exposed areas or unexposed areas of the photoresist material;
iv) coating a layer of gold or an alloy thereof over the remaining photoresist material and on the substrate where the photoresist material has been removed;
v) plating a non-precious metal over the layer of gold or an alloy thereof to form a non-precious metal layer; and
vi) removing the substrate and the photoresist material to form the embossing tool with a three-dimensional structure on an external side and being flat on the other side, wherein the external side of the embossing tool is coated with the layer of gold.
2. The method of claim 1 , wherein the non-precious metal comprises copper, tin, cobalt, nickel, iron, indium, zinc or molybdenum.
3. The method of claim 1 , wherein the alloy comprises gold and one or more of non-precious metals selected from the group consisting of copper, tin, cobalt, nickel, iron, indium, zinc and molybdenum.
4. The method of claim 3 , wherein the total weight of the non-precious metals in the alloy is in the range of 0.001% to 50%.
5. The method of claim 3 , wherein the total weight of the non-precious metals in the alloy is in the range of 0.001% to 10%.
6. The method of claim 1 , wherein the layer of gold or an alloy thereof has a thickness in the range of 0.001 to 10 microns.
7. The method of claim 1 , wherein the layer of gold or an alloy thereof has a thickness in the range of 0.001 to 3 microns.
8. A method for preparing an embossing tool comprising:
i) coating a photoresist material on a substrate;
ii) exposing the photoresist material to a light source;
iii) removing the exposed areas or unexposed areas of the photoresist material;
iv) coating an electrical conductive seed layer over the remaining photoresist material and on the substrate where the photoresist material has been removed;
v) plating a non-precious metal over the electrical conductive seed layer to form a non-precious metal layer;
vi) removing the substrate and the photoresist material to form the embossing tool with a three-dimensional structure on an external side and being flat on the other side; and
vii) coating the external side of the embossing tool with a layer of gold or an alloy thereof.
9. The method of claim 8 , wherein the non-precious metal comprises copper, tin, cobalt, nickel, iron, indium, zinc or molybdenum.
10. The method of claim 8 , wherein the alloy comprises gold and one or more of non-precious metals selected from the group consisting of copper, tin, cobalt, nickel, iron, indium, zinc and molybdenum.
11. The method of claim 10 , wherein the total weight of the non-precious metals in the alloy is in the range of 0.001% to 50%.
12. The method of claim 10 , wherein the total weight of the non-precious metals in the alloy is in the range of 0.001% to 10%.
13. The method of claim 8 , wherein the layer of gold or an alloy thereof has a thickness in the range of 0.001 to 10 microns.
14. The method of claim 8 , wherein the layer of gold or an alloy thereof has a thickness in the range of 0.001 to 3 microns.