Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.
1. A resin-containing lead frame, comprising:
a die pad on which an LED element is to be mounted; and
a lead portion disposed in spaced relation to the die pad;
wherein the die pad and the lead portion have an opposing surface, respectively, the opposing surface of the die pad and the opposing surface of the lead portion opposing each other over a space between the die pad and the lead portion,
wherein the opposing surface of the die pad has a protrusion positioned in a middle portion of the die pad in a thickness direction of the die pad and protruding toward the space,
wherein a reflecting resin fills the space between the die pad and the lead portion, and
wherein a lower surface of the die pad, a lower surface of the lead portion and a lower surface of the reflecting resin are coplanar.
2. A semiconductor device comprising:
a die paid;
a lead portion disposed in spaced relation to the die pad;
an LED element mounted on the die pad;
an electric conductor for electrically connecting the lead portion and the LED element; and
a sealing resin for sealing the LED element and the electric conductor;
wherein the die pad and the lead portion have an opposing surface, respectively, the opposing surface of the die pad and the opposing surface of the lead portion opposing each other over a space between the die pad and the lead portion,
wherein the opposing surface of the die pad has a protrusion positioned in a middle portion of the die pad in a thickness direction of the die pad and protruding toward the space,
wherein a reflecting resin fills the space between the die pad and the lead portion, and
wherein a lower surface of the die pad, a lower surface of the lead portion and a lower surface of the reflecting resin are coplanar.