IP Library Granted Patent US 9,936,571
Granted Patent B2
US 9,936,571 · App. 14/843,115 · Granted Apr 3, 2018

Printed circuit board

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Quick Facts
Patent No.
US 9,936,571
App. No.
14/843,115
Granted
Apr 3, 2018
Kind
B2
Abstract

A PCB includes a PCB body at least including a first metal layer, a second metal layer, and a first ground layer sandwiched therebetween; and a pair of transmission lines including a first transmission line conductor and a second transmission line conductor. The first transmission line conductor is located in the first metal layer which has two straight line sections at its two ends and a curved line section at its middle, the second transmission line conductor has two straight line sections at its two ends which are located in the first metal layer and a cross-via structure at the middle which has a buried trace buried in the second metal layer, and the curved line section and the buried trace are isolated by the first ground layer. Skew effect of the differential transmission circuit is reduced, thereby improving the signal transmission quality and improve signal transmission speed.

Claims (19)

1. A printed circuit board comprising:

a printed circuit board body including at least a first metal layer, a second metal layer formed below the first metal layer, and a first ground layer sandwiched between the first metal layer and the second metal layer; and

a pair of transmission lines provided to transmit differential signals, the pair of transmission lines including a first transmission line conductor and a second transmission line conductor;

wherein the first transmission line conductor is located in the first metal layer, the first transmission line conductor has two straight line sections at its two ends and a curved line section at its middle, the second transmission line conductor has two straight line sections at its two ends and a cross-via structure including a buried trace at its middle, and the curved line section of the first transmission line conductor and the buried trace of the cross-via structure of the second transmission line conductor are isolated by the first ground layer, wherein the total physical length of the first transmission line conductor is longer than that of the second transmission line conductor.

2. A printed circuit board comprising:

a printed circuit board body including at least a first metal layer, a second metal layer formed below the first metal layer, and a first ground layer sandwiched between the first metal layer and the second metal layer; and

a pair of transmission lines provided to transmit differential signals, the pair of transmission lines including a first transmission line conductor and a second transmission line conductor;

wherein the first transmission line conductor is located in the first metal layer, the first transmission line conductor has two straight line sections at its two ends and a curved line section at its middle, the second transmission line conductor has two straight line sections at its two ends and a cross-via structure including a buried trace at its middle, and the curved line section of the first transmission line conductor and the buried trace of the cross-via structure of the second transmission line conductor are isolated by the first ground layer, wherein the curved line section serving as a delay line is roughly S-shaped with two curved portions.

3. The printed circuit board according to claim 2 , wherein the cross-via structure of the second transmission line conductor comprises two via pins extended from the first metal layer to the second metal layer without contacting the first ground layer, and the buried trace of the second transmission line conductor connects the two via pins.

4. The printed circuit board according to claim 3 , wherein two first cut-out regions are formed on the first ground layer to accept the via pins, and a second cut-out region is formed on the second metal layer to accept the buried trace, and the area of each first cut-out region is smaller than that of the second cut-out region.

5. The printed circuit board according to claim 4 , further comprising a second ground layer under the second metal layer, and several grounding paths extending from the first ground layer to the second ground layer under the second metal layer, connecting to the second metal layer outside the second cut-out region, and located around the second cut-out region.

6. The printed circuit board according to claim 4 , wherein a region of the ground layer located on the first ground layer and between the two first cut-out regions is not hollowed.

7. The printed circuit board according to claim 2 , wherein the total physical length of the first transmission line conductor is longer than that of the second transmission line conductor.

8. The printed circuit board according to claim 2 , further comprising multiple inner layers formed between the first ground layer and the second metal layer, and a support layer.

9. A printed circuit board comprising:

a printed circuit board body including at least a first metal layer, a first ground layer formed below the first metal layer, and a bottom layer formed below the first ground layer; and

a pair of transmission lines provided to transmit differential signals, the pair of transmission lines including a first transmission line conductor and a second transmission line conductor;

wherein the first transmission line conductor is located in the first metal layer, the first transmission line conductor has two straight line sections at its two ends and a curved line section at its middle, the second transmission line conductor has two straight line sections at its two ends and a cross-via structure at its middle, the two straight line sections of the second transmission line conductors are located in the first metal layer, the cross-via structure of the second transmission line conductor has a trace located in an outer surface of the bottom layer of the printed circuit board body, and the curved line section of the first transmission line conductor and the trace of the cross-via structure of the second transmission line conductor are isolated by the first ground layer, wherein the curved line section serving as a delay line is roughly S-shaped with two curved portions.

10. The printed circuit board according to claim 9 , wherein the printed circuit board body further comprises a second metal layer sandwiched between the first ground layer and the bottom layer.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2025
From: LUMENTUM OPERATIONS LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 074974/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2025
From: CLOUD LIGHT TECHNOLOGY LIMITED
To: LUMENTUM OPERATIONS LLC
Reel/Frame 072717/0543 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2018
From: SAE MAGNETICS (H.K.) LTD.
To: CLOUD LIGHT TECHNOLOGY LIMITED
Reel/Frame 046569/0754 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2015
From: LAM, FUK MING
To: SAE MAGNETICS (H.K.) LTD.
Reel/Frame 036554/0932 →