SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
According to one embodiment, a semiconductor device includes: a semiconductor substrate; and an insulating film provided above the semiconductor substrate. The insulating film includes: a plurality of first particles having a periodic structure; a plurality of second particles provided between the plurality of first particles and having an average particle outline size smaller than an average particle outline size of the plurality of first particles; and a filler provided between at least one of the plurality of first particles and the plurality of second particles.
1 . A semiconductor device comprising:
a semiconductor substrate; and
an insulating film provided above the semiconductor substrate,
the insulating film including:
a plurality of first particles having a periodic structure;
a plurality of second particles provided between the plurality of first particles and having an average particle outline size smaller than an average particle outline size of the plurality of first particles; and
a filler provided between at least one of the plurality of first particles and the plurality of second particles.
2 . The device according to claim 1 , wherein the plurality of first particles contacts each other, and the plurality of first particles and the plurality of second particles contact each other.
3 . The device according to claim 1 , wherein the plurality of first particles has a hexagonal closest packing structure.
4 . The device according to claim 1 , wherein at least one of the plurality of first particles and the plurality of second particles contains silica.
5 . The device according to claim 1 , wherein the filler is an insulator derived from at least one of hydrogen silsesquioxane and perhydropolysilazane.
6 . The device according to claim 1 , wherein an average particle outline size of the plurality of second particles is 0.42 or less times an average particle outline size of the plurality of first particles.
7 . The device according to claim 1 , wherein an average particle outline size of the plurality of second particles is 0.23 or less times an average particle outline size of the plurality of first particles.
8 . The device according to claim 1 , wherein a number ratio of the plurality of second particles to the plurality of first particles is 0.2 or more and 10.0 or less.
9 . The device according to claim 1 , wherein a number ratio of the plurality of second particles to the plurality of first particles is 0.4 or more and 4.0 or less.
10 . The device according to claim 1 , wherein at least one of the first particles and the second particles has a spherical shape.
11 . The device according to claim 1 , wherein at least one of the plurality of first particles and the plurality of second particles has a particle outline size distribution, a value in the particle outline size distribution obtained by dividing a standard deviation of particle outline size by an average value of the particle outline size is 10% or less.
12 . The device according to claim 1 , wherein the plurality of first particles contains a material different from the plurality of second particles.
13 . The device according to claim 1 , wherein a thickness of the insulating film is 10 micrometers or more.
14 . The device according to claim 1 , wherein the filler covers peripheries of the plurality of first particles and the plurality of second particles.
15 . The device according to claim 1 , wherein at least one of the plurality of first particles and the plurality of second particles contains at least one of fumed silica, colloidal silica and fused silica.
16 . The device according to claim 1 , wherein at least one of the plurality of first particles and the plurality of second particles is terminated with oxygen or hydrogen.
17 . The device according to claim 1 , wherein the insulating film is provided on the semiconductor substrate including a step.
18 . The device according to claim 1 , further comprising an intermediate provided in the insulating film.
19 . A manufacturing method of a semiconductor device, comprising:
supplying a first solution onto a substrate and containing:
a plurality of first particles;
a plurality of second particles having an average particle outline size smaller than an average particle outline size of the plurality of first particles; and
a solvent dispersed with the plurality of first particles and the plurality of second particles;
arranging the plurality of first particles periodically by removing the solvent; and
supplying a second solution containing a filler into a gap formed by removing the solvent.
20 . The method according to claim 19 , wherein the arranging the plurality of first particles periodically includes arranging the plurality of first particles in a hexagonal closest packing structure.