Electronic module with cooling system for package-on-package devices
View Patent ↗An apparatus for cooling a POP stacked package within a small form factor electronic module by configuring the enclosure of the module to come into direct contact with the device on the top surface in addition to the bottom surface to create two thermal conduction paths for the POP device to the enclosure. The enclosure itself then acts as the heat sink to draw heat from the device and into the surrounding air external to the optical module.
1. An electronic device module, comprising:
a package-on-package (POP) device including a first package stacked on a second package; and
a thermal conducting enclosure housing the POP device and having a top enclosure portion and a bottom enclosure portion;
a first heat conducting pedestal in thermal contact and adjacent to a surface of the first package and in thermal contact and adjacent to the top enclosure portion for dissipating heat generated by the first package;
a second heat conducting pedestal in thermal contact with connections of the second package and in thermal contact and adjacent to the bottom enclosure portion for dissipating heat generated by the second package, the second heat conducting pedestal being positioned between the second package and the bottom enclosure portion.
2. The electronic device module of claim 1 wherein the first heat conducting pedestal is integrally formed with the top enclosure portion and the second heat conducting pedestal is integrally formed with the bottom enclosure portion.
3. The electronic device module of claim 1 , wherein the first heat conducting pedestal is attached to the top enclosure portion and the second heat conducting pedestal is attached to the bottom enclosure portion.
4. The electronic device module of claim 1 , wherein the top enclosure portion includes a sidewall and the first heat conducting pedestal is in thermal contact with the sidewall.
5. The electronic device module of claim 1 , wherein the bottom enclosure portion includes a sidewall and the second heat conducting pedestal is in thermal contact with the sidewall.
6. The electronic device module of claim 1 , further including
a printed circuit board (PCB) inside the enclosure and having thermal vias extending from a first surface to a second surface of the PCB, wherein the second package of the POP device has the connections connected to the thermal vias, and the second heat conducting pedestal is connected to the thermal vias.
7. The electronic device module of claim 1 , further including a printed circuit board (PCB) inside the enclosure having
a first contact pad on a first surface of the PCB connected to the connections of the second package of the POP device,
a second contact pad on a second surface of the PCB opposing the first surface, connected to the second heat conducting pedestal, and
thermal vias extending from the first contact pad to the second contact pad.
8. The electronic device module of claim 1 , further including
a printed circuit board (PCB) inside of the enclosure, the PCB having a hole formed therein, and
the second first package of the POP device positioned over the hole, and the second heat conducting pedestal is directly connected to the connections of the second package of the POP device through the hole.
9. An electronic device module, comprising:
a thermal conducting enclosure having a first wall and a second wall opposing the first wall;
a printed circuit board (PCB) inside of the enclosure, the PCB having thermal vias extending from a first surface of the PCB to a second surface of the PCB opposing the first surface;
a package-on-package (POP) device including a first package having connections thermally coupled to the thermal vias, and a second package mounted on the first package to form a stack;
a first heat conducting pedestal in contact with the first wall and the second package, for conducting heat from the second package to the enclosure; and
a second heat conducting pedestal in contact with the second wall and thermally coupled to the thermal vias, for conducting heat from the first package to the enclosure.
10. The electronic device module of claim 9 , wherein the first heat conducting pedestal is integrally formed with the first wall and the second heat conducting pedestal is integrally formed with the second wall.
11. The electronic device module of claim 9 , wherein the first wall is connected to a sidewall of the enclosure and the first heat conducting pedestal is in further contact with the sidewall.
12. The electronic device module of claim 9 , wherein the second wall is connected to a sidewall of the enclosure and the second heat conducting pedestal is in further contact with the sidewall.
13. The electronic device module of claim 9 , wherein the connections of the first package are connected to the thermal vias, and the second heat conducting pedestal is connected to the thermal vias.
14. The electronic device module of claim 9 , wherein the PCB includes
a first contact pad on the first surface connected to the connections of the first package, and
a second contact pad on the second surface connected to the second heat conducting pedestal, the thermal vias extending from the first contact pad to the second contact pad.
15. A method for manufacturing an electronic device module, comprising:
producing a top enclosure portion and a first heat conducting pedestal;
producing a bottom enclosure portion and a second heat conducting pedestal;
assembling a printed circuit board (PCB) with a package-on-package (POP) device including a first package stacked on a second package; and
assembling the electronic device module with the first heat conducting pedestal and the second heat conducting pedestal each thermally coupled to a respective package of the POP device, wherein
the first heat conducting pedestal is in thermal contact and adjacent to a surface of the first package and adjacent to the top enclosure portion for dissipating heat generated by the first package, and
the second heat conducting pedestal is in thermal contact with connections of the second package and in thermal contact and adjacent to the bottom enclosure portion for dissipating heat generated by the second package, the second heat conducting pedestal being positioned between the second package and the bottom enclosure portion.
16. The method of claim 15 , wherein producing includes casting the top enclosure portion with the first heat conducting pedestal integrally formed therewith, and casting the bottom enclosure portion with the second heat conducting pedestal integrally formed therewith.
17. The method of claim 15 , wherein producing includes attaching the first heat conducting pedestal to the top enclosure portion and attaching the second heat conducting pedestal to the bottom enclosure portion.
18. The method of claim 15 , wherein assembling the electronic device module includes
applying a thermal interface material (TIM) to each of the first heat conducting pedestal and the second heat conducting pedestal,
installing the PCB into the bottom enclosure portion, and
securing the top enclosure portion to the bottom enclosure portion for encasing the PCB.