Disinfectant composition containing quaternary ammonium compounds
View Patent ↗Disinfectant compositions disclosed herein comprise at least one biocidal quaternary ammonium compound, hydrogen peroxide, and optionally inorganic acid and/or organic acid. Particularly, a composition comprising a biocidal quaternary ammonium chloride compound, hydrogen peroxide, and C1 to C8 carboxylic acid, mono-, di- and tricarboxylic acid enhances significantly its antimicrobial activities of either hydrogen peroxide or the quaternary ammonium chloride alone.
1. A disinfectant composition comprising a biocidal quaternary ammonium compound, hydrogen peroxide, and at least one acid or salt thereof, wherein the quaternary ammonium compound is a compound having the formula (I):
wherein R 1 is an optionally substituted benzyl group or an optionally substituted alkyl or aryl-substituted alkyl group;
R 2 and R 3 are independently optionally substituted alkyl groups;
R 4 is selected from the group consisting of an optionally substituted alkyl or aryl-substituted alkyl group, benzyl group, and [(CH 2 ) 2 —O] n —R 5 , wherein n is an integer from 1 to 20 and R 5 is selected from the group consisting of hydrogen, phenyl, and alkyl-substituted phenyl; and
X − is chlorine, bromine, phosphate, sulfate, or nitrate; and
wherein the composition is a dilutable composition comprising 0.5 to 5% by weight of the quaternary ammonium compound, 0.5 to 25% by weight hydrogen peroxide, and 1-25% by weight of the at least one acid or salts thereof and
wherein the composition is free of peracids.
2. A separate two-part disinfectant composition, wherein a first part of the composition comprises a biocidal quaternary ammonium compound and at least one acid or salt thereof, and wherein a second part of the composition comprises hydrogen peroxide, wherein the quaternary ammonium compound is a compound having the formula (I):
wherein R 1 is an optionally substituted benzyl group or an optionally substituted alkyl or aryl-substituted alkyl group;
R 2 and R 3 are independently optionally substituted alkyl groups;
R 4 is selected from the group consisting of an optionally substituted alkyl or aryl-substituted alkyl group, benzyl group, and [(CH 2 ) 2 —O] n —R 5 , wherein n is an integer from 1 to 20 and R 5 is selected from the group consisting of hydrogen, phenyl, and alkyl-substituted phenyl; and
X − is chlorine, bromine, phosphate, sulfate, or nitrate; and
wherein the composition is a dilutable composition comprising 0.5 to 5% by weight quaternary ammonium compound, 0.5 to 25% by weight hydrogen peroxide, and 1-25% by weight the acid or salt thereof, and
wherein the composition is free of peracids.
3. The composition according to claim 1 , wherein R 1 and R 4 are C 1-22 alkyl.
4. The composition according to claim 1 , wherein R 2 and R 3 are C 1 -C 4 alkyl.
5. The composition according to claim 1 , wherein R 1 and R 4 are C 1-22 alkyl, and R 2 and R 3 are methyl.
6. The composition according to claim 1 , wherein the quaternary ammonium compound comprises didecyl dimethyl ammonium chloride and/or C 8 -C 18 alkyldimethylbenzylammonium chloride.
7. The composition according to claim 1 , wherein the acid is in the form of an alkaline metal salt of the acid.
8. A method of killing or inhibiting growth of microorganisms on a surface comprising diluting the composition according to claim 1 with water, and then applying the diluted composition to a surface.
9. The composition according to claim 1 , wherein the composition is a dilutable composition comprising 2-5% by weight quaternary ammonium compound, 3-8% by weight hydrogen peroxide, and 1-5% by weight the acid or salt thereof.
10. A disinfectant composition comprising a biocidal quaternary ammonium compound, hydrogen peroxide, and at least one acid or salt thereof, wherein the quaternary ammonium compound is a compound having the formula (I):
wherein R 1 is an optionally substituted benzyl group or an optionally substituted alkyl or aryl-substituted alkyl group;
R 2 and R 3 are independently optionally substituted alkyl groups;
R 4 is selected from the group consisting of an optionally substituted alkyl or aryl-substituted alkyl group, benzyl group, and —[(CH 2 ) 2 —O] n —R 5 , wherein n is an integer from 1 to 20 and R 5 is selected from the group consisting of hydrogen, phenyl, and alkyl-substituted phenyl; and
X − is chlorine, bromine, phosphate, sulfate, or nitrate;
wherein the composition is a ready to use composition comprising 0.01-1.5% by weight quaternary ammonium compound, 0.1-1.5% by weight hydrogen peroxide, and 0.5 to 4% by weight acid, and
wherein the composition is free of peracids.
11. The composition according to claim 1 , further comprising a stabilizer, solvent, or additive.
12. The composition according to claim 11 , wherein the solvent is present and selected from the group consisting of: water, ethanol, propanol, isopropanol, propylene glycol, dipropylene glycol n-propyl ether, and dipropylene glycol methyl ether.
13. The composition according to claim 1 , further comprising a chelant and/or a corrosion inhibitor.
14. A method of killing or inhibiting growth of microorganisms on a surface comprising applying the composition of claim 1 to a surface.
15. The method according to claim 14 , wherein the microorganisms comprise one or more of Gram positive bacteria, Gram negative bacteria, viruses, fungi, mildew, or mold.
16. The method according to claim 14 , wherein the microorganisms comprise one or more of Staphylococcus, Pseudomonas, Bacillus , hepatitis, rotavirus, rhinovirus, or Mycobacterium terrae.
17. The composition according to claim 1 , comprising at least two acids or salts thereof selected from the group consisting of citric acid, phosphoric acid, glutaric acid, succinic acid, lactic acid, S,S-ethylenediamine-N,N′-disuccinic acid, 1-hydroxyethane 1,1-diphosphonic acid (HEDP), dipicolinic acid (DPA), methanesulfonic acid (MSA), acetic acid, tartaric acid, adipic acid, oxalic acid, sulfamic acid, benzoic acid, formic acid, glycolic acid, polymeric acid, phytic acid, phosphoacetic acid, diethylenetriaminepentakis(methylphosphonoic acid), and N-(phosphonomethyl)iminodiacetic acid, or salts thereof.
18. The method according to claim 14 , wherein the composition demonstrates a minimum of 5 log reduction of microorganisms within about 5 minutes of contact time with the microorganisms.
19. The composition according to claim 17 , wherein the at least two acids or salt thereof comprise at least one acid selected from the group consisting of citric acid, succinic acid, phosphoric acid, glutaric acid, dipicolinic acid (DPA), and lactic acid in combination with at least one acid selected from the group consisting of S,S-ethylenediamine-N,N′-disuccinic acid or its alkaline salt, 1-hydroxyethane 1,1-diphosphonic acid (HEDP), and methanesulfonic acid (MSA).
20. The composition according to claim 1 , wherein there are at least two acids, and the acids are selected from the group consisting of citric acid, phosphoric acid, succinic acid, glutaric acid, dipicolinic acid (DPA), lactic acid, S,S-ethylenediamine-N,N′-disuccinic acid or its alkaline salt, 1-hydroxyethane 1,1-diphosphonic acid (HEDP), and methanesulfonic acid (MSA).
21. The composition according to claim 1 , wherein the at least one acid or salt thereof is selected from the group consisting of citric acid, phosphoric acid, glutaric acid, succinic acid, lactic acid, S,S-ethylenediamine-N,N′-disuccinic acid, 1-hydroxyethane 1,1-diphosphonic acid (HEDP), dipicolinic acid (DPA), methanesulfonic acid (MSA), acetic acid, tartaric acid, adipic acid, oxalic acid, sulfamic acid, benzoic acid, formic acid, glycolic acid, polymeric acid, phytic acid, phosphoacetic acid, diethylenetriaminepentakis(methylphosphonoic acid), and N-(phosphonomethyl)iminodiacetic acid, or salt thereof.