Integrated power module with improved isolation and thermal conductivity
An integrated power module having a depletion mode device and an enhancement mode device that is configured to prevent an accidental on-state condition for the depletion mode device during a gate signal loss is disclosed. In particular, the disclosed integrated power module is structured to provide improved isolation and thermal conductivity. The structure includes a substrate having a bottom drain pad for the depletion mode device disposed on the substrate and an enhancement mode device footprint-sized cavity that extends through the substrate to the bottom drain pad. A thermally conductive and electrically insulating slug substantially fills the cavity to provide a higher efficient thermal path between the enhancement mode device and the bottom drain pad for the depletion mode device.
1. An integrated power module having a depletion mode device and an enhancement mode device that is configured to prevent an accidental on-state condition for the depletion mode device during a gate signal loss comprising:
a substrate having a bottom drain pad for the depletion mode device disposed on the substrate and an enhancement mode device footprint-sized cavity that extends through the substrate to the bottom drain pad; and
a thermally conductive and electrically insulating slug substantially fills the cavity.
2. The integrated power module of claim 1 wherein non-conductive epoxy fills gaps within the cavity between the thermally conductive and electrically insulating slug and the substrate.
3. The integrated power module of claim 1 further including a top drain pad for the enhancement mode device wherein the top drain pad is substantially centered over the cavity.
4. The integrated power module of claim 3 further including electrically conductive plating disposed over the top drain pad and the thermally conductive and electrically insulating slug.
5. The integrated power module of claim 1 wherein the substrate includes a depletion mode device footprint-sized cavity that extends through the substrate to the bottom drain pad.
6. The integrated power module of claim 5 further including a thermally conductive and electrically conductive slug that substantially fills the depletion mode device footprint-sized cavity.
7. The integrated power module of claim 6 wherein the thermally conductive and electrically conductive slug has a thermal conductivity of at least 150 Watts per meter Kelvin (W/mK).
8. The integrated power module of claim 7 wherein the thermally conductive and electrically conductive slug is made of copper.
9. The integrated power module of claim 6 wherein non-conductive epoxy fills gaps within the depletion mode device footprint-sized cavity between the thermally conductive and electrically conductive slug and the substrate.
10. The integrated power module of claim 9 further including a top drain pad for the depletion mode device wherein the top drain pad is substantially centered over the depletion mode device footprint-sized cavity.
11. The integrated power module of claim 5 further including a thermally conductive and electrically isolating slug that substantially fills the depletion mode device footprint-sized cavity.
12. The integrated power module of claim 11 wherein non-conductive epoxy fills gaps within the depletion mode device footprint-sized cavity between the thermally conductive and electrically isolating slug and the substrate.
13. The integrated power module of claim 12 further including a top drain pad to which a drain of the depletion mode device is electrically coupled.
14. The integrated power module of claim 13 further including electrically conductive vias between the top drain pad and the bottom drain pad.
15. The integrated power module of claim 14 further including electrically conductive plating that covers the top drain pad and the thermally conductive and electrically isolating slug and the substrate.
16. The integrated power module of claim 1 wherein the thermally conductive and electrically insulating slug is direct bonded copper (DBC) with a ceramic substrate.
17. The integrated power module of claim 16 wherein the ceramic substrate is made of alumina (Al 2 O 3 ).
18. The integrated power module of claim 16 wherein the ceramic substrate is made of aluminum nitride (AlN).
19. The integrated power module of claim 16 wherein the ceramic substrate is made of beryllium oxide (BeO).
20. The integrated power module of claim 16 wherein the thermal conductivity of the DBC has a thermal conductivity of at least 150 Watts per meter Kelvin (W/m K).