Polishing apparatus, polishing method, and semiconductor manufacturing method
View Patent ↗A polishing apparatus includes a polisher, a holder, and a supplier. The polisher polishes a semiconductor substrate or a polishing target film on a semiconductor substrate. The holder holds the semiconductor substrate and presses the semiconductor substrate or the polishing target film against the polisher to rub the semiconductor substrate or the polishing target film against the polisher. The supplier has a nozzle that is to be inserted to the inside of the polisher and that supplies a polishing solution to the inside of the polisher.
1. A polishing apparatus comprising:
a holder provided to face a surface of a polishing pad polishing a semiconductor substrate or a polishing target film on a semiconductor substrate, holding the semiconductor substrate and pressing the semiconductor substrate or the polishing target film against the polishing pad to rub the semiconductor substrate or the polishing target film against the polishing pad; and
a supplier arranged on an area of the polishing pad different from an area of the polishing pad on which the holder is positioned and having a nozzle that is to be inserted to inside of the polishing pad and that supplies a polishing solution to the inside of the polishing pad, wherein
the supplier rotates on the polishing pad and forms a notch on the polishing pad by inserting the nozzle into the polishing pad; and
the nozzle discharges the polishing solution to the inside of the polishing pad at the notch.
2. The apparatus of claim 1 , wherein the supplier includes a plurality of the nozzles.
3. The apparatus of Claim 1 , wherein
the polishing pad comprises a circular polishing surface to rotate around a center of the polishing surface,
the supplier includes a cylindrical member rotating on the polishing surface with rotation of the polishing pad, and
the nozzle protrudes from a surface of the cylindrical member.
4. The apparatus of claim 3 , wherein the cylindrical member internally comprises a hollow space that communicates with the nozzle and supplies the polishing solution to the nozzle via the hollow space.
5. The apparatus of claim 3 , wherein the cylindrical member is positioned between a central portion of the polishing pad and an end portion of the polishing pad and rotates while inserting the nozzle to the inside of the polishing pad with rotation of the polishing pad.
6. The apparatus of claim 1 , wherein the nozzle is provided on a dresser.
7. A polishing method comprising:
inserting a nozzle to inside of a polishing pad that polishes a semiconductor substrate or a polishing target film on a semiconductor substrate and supplying a polishing solution to the inside of the polishing pad through the nozzle; and
rubbing the semiconductor substrate or the polishing target film against the polishing pad having the polishing solution supplied therein with the semiconductor substrate or the polishing target film pressed against the polishing pad in an area different from an area on which the nozzle is positioned, wherein
the nozzle rotates on the polishing pad and forms a notch on the polishing pad by inserting into the polishing pad: and
the nozzle discharges the polishing solution to the inside of the polishing pad at the notch.
8. The method of claim 7 , wherein
the polishing pad comprises a circular polishing surface,
the nozzle protrudes from a surface of a cylindrical member, and
the polishing pad is rotated around a center of the polishing surface and the cylindrical member is rotated on the polishing surface with rotation of the polishing pad.
9. The method of claim 8 , wherein the cylindrical member is positioned between a central portion of the polishing pad and an end portion of the polishing pad and is rotated while inserting the nozzle to the inside of the polishing pad with rotation of the polishing pad.
10. The method of claim 8 , wherein
the cylindrical member internally comprises a hollow space that communicates with the nozzle, and
the polishing solution is supplied to the nozzle via the hollow space.
11. A semiconductor manufacturing method comprising:
inserting a nozzle to inside of a polishing pad that polishes a semiconductor substrate or a polishing target film on a semiconductor substrate and supplying a polishing solution to the inside of the polishing pad through the nozzle; and
rubbing the semiconductor substrate or the polishing target film against the polishing pad having the polishing solution supplied therein with the semiconductor substrate or the polishing target film pressed against the polishing pad in an area different from an area on which the nozzle is positioned, wherein
the nozzle rotates on the polishing pad and forms a notch on the polishing pad by inserting into the polishing pad; and
the nozzle discharges the polishing solution to the inside of the polishing pad at the notch.