Thermosiphon with bent tube section
A thermosiphon device including one or more multi-port tubes that form both an evaporator section and a condenser section for the device. The one or more tubes may be flat tubes with multiple, parallel flow channels, and may be bent to form a bend between the evaporator and condenser sections of the tube(s). One or more flow channels of the tube at the bend may provide a vapor flow path or a liquid flow path between the evaporator and condenser sections.
1. A thermosiphon device, comprising:
at least one multi-port tube including first and second ends and a plurality of channels each extending between the first and second ends, the multi-port tube having a bend between condenser and evaporator sections of the multi-port tube, the condenser section being between the first end and the bend of the multi-port tube and the evaporator section being between the second end and the bend of the multi-port tube;
at least one manifold in fluid communication with the first and second ends of the multi-port tube; and
a panel arranged between the condenser and evaporator sections that defines a dividing point between portions inside of an enclosure and an environment outside of the enclosure, wherein the thermosiphon device is constructed and arranged such that heat is transferred between the evaporator section and the condenser section, through the panel, via flow of working fluid,
wherein the condenser section and the evaporator section are connected only via the bend of a multi-port tube and the at least one manifold, wherein the thermosiphon device is adapted for flow of working fluid in which evaporated fluid flows upwardly in the evaporator section and to the condenser section via a vapor flow path, and condensed liquid flows downwardly in the condenser section and to the evaporator section via a liquid flow path, wherein the vapor flow path is different from the liquid flow path, and wherein the bend between the condenser and evaporator sections providing the vapor flow path to conduct fluid evaporated in the evaporator section to the condenser section or the liquid flow path to conduct condensed liquid from the condenser section to the evaporator section.
2. The device of claim 1 , wherein the bend extends over at least 90 degrees.
3. The device of claim 1 , wherein the bend extends over at least 180 degrees.
4. The device of claim 1 , wherein the bend provides a vapor flow path to conduct fluid evaporated in the evaporator section to the condenser section.
5. The device of claim 1 , wherein the bend provides a liquid flow path to conduct condensed liquid from the condenser section to the evaporator section.
6. The device of claim 1 , wherein the device includes a single manifold that is connected to the first and second ends of the at least one multi-port tube.
7. The device of claim 1 , wherein the at least one manifold includes first and second manifolds, the first manifold being connected to the first end and the second manifold being connected to the second end.
8. The device of claim 1 , wherein the at least one multi-port tube is formed as a flat tube having a plurality of parallel flow channels.
9. The device of claim 8 , wherein the at least one multi-port tube is bent about an axis that is perpendicular to a plane of the flat tube to form the bend.
10. The device of claim 9 , wherein the at least one multi-port tube is additionally twisted about an axis that extends along a length of the flat tube.
11. The device of claim 1 , comprising fins in thermal contact with the evaporator and/or condenser section of the multi-port tube.
12. The device of claim 1 , comprising a plurality of multi-port tubes, wherein the device includes a single manifold that is connected to the first and second ends of the multi-port tubes, and wherein the first and second ends are arranged along a single line on the single manifold.
13. The device of claim 12 , wherein the first and second ends alternate with each other.
14. The device of claim 1 , wherein the bend between the condenser and evaporator sections provides a liquid flow path to conduct condensed liquid from the condenser section to the evaporator section, wherein the device includes first and second manifolds, the first manifold being connected to the first end of the multi-port tube and the second manifold being connected to the second end of the multi-port tube, and wherein at least one channel of the at least one multi-port tube is arranged to function as a vapor supply path to conduct evaporated fluid from the second manifold to the first manifold.
15. The device of claim 14 , further comprising heat transfer structure in contact with a section of the evaporator section to overheat vapor in the vapor supply path.
16. The device of claim 1 , further comprising a heat transfer structure in thermal contact with portions of the at least one multi-port tube other than portions which provide a vapor flow path or liquid flow path.