Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same
View Patent ↗A printed circuit module and methods for manufacturing the same are disclosed. The printed circuit module includes a printed circuit substrate with a thinned die attached to the printed circuit substrate. The thinned die includes at least one device layer over the printed circuit substrate and a buried oxide (BOX) layer over the at least one device layer. A polymer layer is disposed over the BOX layer, wherein the polymer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 10 3 Ohm-cm.
1. A printed circuit module comprising:
a printed circuit substrate;
a thinned die attached to the printed circuit substrate and having at least one device layer over the printed circuit substrate and a buried oxide (BOX) layer over the at least one device layer;
a top protective layer disposed onto the printed circuit substrate and up alongside the thinned die to at least a portion of the BOX layer; and
a polymer layer over the BOX layer, wherein the polymer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 10 3 Ohm-cm.
2. The circuit board of claim 1 wherein the top protective layer resides between the printed circuit substrate and the polymer layer.
3. The printed circuit module of claim 1 further including a bonding layer disposed onto the BOX layer.
4. The printed circuit module of claim 3 wherein the bonding layer is made of silicon nitride.
5. The printed circuit module of claim 1 further including an outer plastic layer disposed over the polymer layer to provide additional rigidity to the printed circuit module.
6. The printed circuit module of claim 5 wherein the outer plastic layer is cured epoxy.
7. The printed circuit module of claim 1 wherein a thickness of the polymer layer ranges from about 100 μm to around 500 μm.
8. The printed circuit module of claim 1 wherein the thinned die is a radio frequency integrated circuit (RFIC).
9. The printed circuit module of claim 1 wherein the thermal conductivity of the polymer layer ranges from around about 10 W/mK to around about 50 W/mK.
10. The printed circuit module of claim 1 wherein the thermal conductivity of the polymer layer ranges from around about 50 W/mK to around about 6600 W/mK.
11. The printed circuit module of claim 1 wherein the electrical resistivity of the polymer layer ranges from around about 10 12 Ohm-cm to around about 10 16 Ohm-cm.
12. The printed circuit module of claim 1 wherein the electrical resistivity of the polymer layer ranges from around about 10 3 Ohm-cm to around about 10 12 Ohm-cm.