Foil-based metallization of solar cells using removable protection layer
View Patent ↗Approaches for foil-based metallization of solar cells are described. For example, a method of fabricating a solar cell involves placing a metal foil over a metalized surface of a wafer of the solar cell. The method further involves placing a protection layer over the metal foil. The method further involves locating the metal foil with the metalized surface of the wafer. The protection layer preserves an optically consistent surface of the metal foil during the locating. The method also involves, subsequent to the locating, electrically contacting the metal foil to the metalized surface of the wafer.
1. A method of fabricating a solar cell, the method comprising:
placing a metal foil over a metalized surface of a wafer of the solar cell;
placing a protection layer over the metal foil;
locating the metal foil with the metalized surface of the wafer, wherein the protection layer preserves an optically consistent surface of the metal foil during the locating;
subsequent to the locating, electrically contacting the metal foil to the metalized surface of the wafer; and
subsequent to electrically contacting the metal foil to the metalized surface of the wafer, removing the protection layer from the metal foil.
2. The method of claim 1 , wherein electrically contacting the metal foil to the metalized surface of the wafer comprises laser welding through the protection layer.
3. The method of claim 2 , wherein the protection layer is substantially transparent to a laser used for the laser welding.
4. The method of claim 1 , wherein preserving the optically consistent surface of the metal foil during the locating comprises slightly deforming the metal foil, but not streaking, stretching or scuffing the metal foil.
5. The method of claim 1 , wherein preserving the optically consistent surface of the metal foil during the locating comprises forming essentially no deformation in the metal foil.
6. The method of claim 1 , wherein the metal foil has a surface area substantially larger than a surface area of the wafer of the solar cell, the method further comprising:
subsequent to electrically contacting the metal foil to the metalized surface of the wafer, cutting to the metal foil to provide the metal foil having a surface area substantially the same as the surface area of the wafer of the solar cell.
7. The method of claim 1 , further comprising:
prior to placing the metal foil over the metalized surface of the wafer of the solar cell, cutting a large sheet of foil to provide the metal foil having a surface area substantially the same as a surface area of the wafer of the solar cell.
8. The method of claim 1 , wherein placing the metal foil over the metalized surface of the wafer of the solar cell comprises adhering the metal foil to the metalized surface of the wafer of the solar cell by vacuum suction prior to placing the protection layer over the metal foil.
9. The method of claim 1 , wherein locating the metal foil with the metalized surface of the wafer comprises applying pressure by using an applicator selected from the group consisting of a roller, a diamond-shaped applicator, and a squeegee.
10. The method of claims 9 , wherein applying pressure by using the applicator comprises removing air and physical gaps from between the metal foil and the metalized surface of the wafer.
11. The method of claim 1 , wherein the metal foil has one or more holes there through, the one or more holes for enabling vacuum adhesion of the protection layer to the metal foil during the placing the protection layer over the metal foil.
12. The method of claim 1 , wherein the metalized surface of the wafer of the solar cell comprises alternating N-type and P-type semiconductor regions and a plurality of metal seed material regions on each of the alternating N-type and P-type semiconductor regions, and wherein locating the metal foil comprises contacting the metal foil to the plurality of metal seed material regions.
13. A method of fabricating a solar cell, the method comprising:
placing an aluminum foil over a metalized surface of a wafer of the solar cell, the metalized surface of the wafer of the solar cell comprises alternating N-type and P-type semiconductor regions and a plurality of aluminum seed regions on each of the alternating N-type and P-type semiconductor regions;
placing a protection layer over the aluminum foil;
locating the aluminum foil with the metalized surface of the wafer, wherein the protection layer preserves an optically consistent surface of the aluminum foil during the locating, and wherein locating the aluminum foil comprises contacting the aluminum foil to the plurality of aluminum seed regions;
subsequent to the locating, electrically contacting the aluminum foil to the metalized surface of the wafer; and
subsequent to electrically contacting the aluminum foil to the metalized surface of the wafer, removing the protection layer from the aluminum foil.
14. The method of claim 13 , wherein electrically contacting the aluminum foil to the metalized surface of the wafer comprises laser welding through the protection layer.
15. The method of claim 14 , wherein the protection layer is substantially transparent to a laser used for the laser welding.
16. The method of claim 13 , wherein preserving the optically consistent surface of the aluminum foil during the locating comprises slightly deforming the aluminum foil, but not streaking, stretching or scuffing the aluminum foil.
17. The method of claim 13 , wherein preserving the optically consistent surface of the aluminum foil during the locating comprises forming essentially no deformation in the aluminum foil.
18. The method of claim 13 , further comprising:
prior to placing the aluminum foil over the metalized surface of the wafer of the solar cell, cutting a large sheet of foil to provide the aluminum foil having a surface area substantially the same as a surface area of the wafer of the solar cell.
19. The method of claim 13 , wherein locating the aluminum foil with the metalized surface of the wafer comprises applying pressure by using an applicator selected from the group consisting of a roller, a diamond-shaped applicator, and a squeegee.
20. The method of claims 19 , wherein applying pressure by using the applicator comprises removing air and physical gaps from between the aluminum foil and the metalized surface of the wafer.