IP Library Granted Patent US 9,648,260
Granted Patent B2
US 9,648,260 · App. 14/856,064 · Granted May 9, 2017

Solid-state image taking device with uniform noise distribution

Inventor: Takashi Machida (Kanagawa, JP)
Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
H04N5/363H01L27/1463H01L27/14603H01L27/14612H01L27/14623H04N5/2353H04N5/3595H04N5/378H04N5/37452
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Quick Facts
Patent No.
US 9,648,260
App. No.
14/856,064
Granted
May 9, 2017
Kind
B2
Abstract

A solid-state image taking device including a pixel section and a scan driving section wherein on each pixel column included in the pixel area determined in advance to serve as a pixel column having the unit pixels laid out in the scan direction, the opto-electric conversion section and the electric-charge holding section are laid out alternately and repeatedly, and on each of the pixel columns in the pixel area determined in advance, two the electric-charge holding sections of two adjacent ones of the unit pixels are laid out disproportionately toward one side of the scan direction with respect to the optical-path limiting section or the opto-electric conversion section.

Claims (12)

1. An imaging device comprising;

a first pixel unit including (a) a first photoelectric conversion element that generates a first signal, (b) a first memory that holds the first signal, and (c) a first transfer gate that transfers the first signal from the first photoelectric conversion element to the first memory;

a second pixel unit including (a) a second photoelectric conversion element that generates a second signal, (b) a second memory that holds the second signal, and (c) a second transfer gate that transfers the second signal from the second photoelectric conversion element to the second memory,

an element separation portion isolating the first and second pixel units from each other; and

a light shielding film,

wherein,

first pixel unit is adjacent to the second pixel unit, and, in a cross section view, a distance between the first memory and the second photoelectric conversion element is longer than a distance between the first memory and the first photoelectric conversion element, and

the light shielding film is disposed over the element separation portion, and portions of the first photoelectric conversion element and the second photoelectric conversion element.

2. The imaging device according to claim 1 , the element separation portion is disposed between the first memory and the second photoelectric conversion element.

3. The imaging device according to claim 1 , further comprising a first insulating film disposed between the first memory and the first transfer gate.

4. The imaging device according to claim 1 further comprising a second insulating film disposed between the light shielding film and the first transfer gate.

5. The imaging device according to claim 4 , wherein the first transfer gate is surrounded by the light shielding film and the element separation portion.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 039240/0429 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 1, 2015
From: MACHIDA, TAKASHI
To: SONY CORPORATION
Reel/Frame 036742/0151 →
Priority Claims (1)
JP 2010-070252 · Mar 25, 2010 · national
Continuity (3)
Continuation 14087281 · Nov 22, 2013
Division 13043913 · Mar 9, 2011
Related Publication 20160006959A1 · Jan 7, 2016