COMPOSITE WIRING BOARD AND MOUNTING STRUCTURE OF THE SAME
A composite wiring board includes a first wiring board having an opening for housing an electronic component, and including a plurality of first connection pads on an upper surface and a plurality of second connection pads on a lower surface, and a second wiring board having the electronic component mounted on a lower surface, including a third connection pad provided on the lower surface on an outer peripheral side and bonded to the first connection pad through a solder, and disposed on the first wiring board so as to cover the opening, in which a grounding inner wall conductor layer is deposited on an inner wall of the opening around the electronic component, and a grounding conductor layer is deposited on the lower surface of the second wiring board and connected to the inner wall conductor layer through a solder.
1 . A composite wiring board comprising:
a first wiring board having an opening for housing an electronic component, and including a plurality of first connection pads on a first surface and a plurality of second connection pads on a second surface; and
a second wiring board having the electronic component mounted on a first surface, including a third connection pad provided outside the mounted electronic component on the first surface and bonded to the first connection pad through a solder, and disposed on the first surface of the first wiring board so as to cover the opening with the first surface, wherein
a grounding inner wall conductor layer is deposited on an inner wall of the opening from the first surface to the second surface around the electronic component, and a grounding conductor layer is deposited on the first surface of the second wiring board and connected to the inner wall conductor layer through a solder.
2 . The composite wiring board according to claim 1 , wherein
the first wiring board includes a through-hole, and the first connection pad and the second connection pad are connected to each other through a wiring conductor in the through-hole.
3 . The composite wiring board according to claim 1 , wherein
an outer wall conductor layer is deposited on an outer peripheral wall of the first wiring board from the first surface to the second surface.
4 . The composite wiring board according to claim 1 , wherein
a fourth connection pad is further formed on the first surface of the second wiring board and connected to the electronic component.
5 . The composite wiring board according to claim 1 , wherein
a fifth connection pad is further formed on the second surface of the second wiring board and connected to another electronic component.
6 . The composite wiring board according to claim 1 , wherein
a grounding conductor layer is provided at least on the first surface of the second wiring board.
7 . The composite wiring board according to claim 6 , wherein
the grounding conductor layer is connected to the inner wall conductor layer and an outer wall conductor layer of the first wiring board through a solder.
8 . A mounting structure, wherein
the composite wiring board having the electronic component according to claim 1 is mounted on a third wiring board including a connection pad bonded to the second connection pad through a solder, and a grounding conductor layer bonded to the inner wall conductor layer through a solder.