High capacitance single layer capacitor
View Patent ↗A high capacitance single layer ceramic capacitor having a ceramic dielectric body containing one or more internal electrodes electrically connected to a metallization layer applied to the side and a top or bottom surface and a metallization pad electrically isolated from the metallization side and the top or bottom surface by a castellation or a via or separated by a dielectric insulating band positioned between the electrodes around the perimeter of the ceramic body and separating the top and bottom surfaces.
1. A high capacitance single layer ceramic capacitor comprising a ceramic dielectric body having at least one internal electrode extending across a portion of the width thereof and in electrical contact with a conductive metallization layer positioned on at least a portion of one side and an entire top or bottom surface of the ceramic body, and at least one electrically isolated metallization pad positioned on an opposite top or bottom surface of the ceramic body and electrically isolated from all electrodes inside the single layer ceramic dielectric body.
2. The capacitor of claim 1 , further having two or more electrodes spaced within the ceramic body.
3. The capacitor of claim 1 , wherein there are a plurality of metallization pads electrically isolated from one another on the top or bottom surface of the capacitor.
4. The capacitor of claim 3 , wherein the metallization pads are different sizes.
5. The capacitor of claim 1 , wherein the ceramic body has a castellation having a metallization layer along a side surface for electrical connection with a second electrode.
6. The capacitor of claim 1 , wherein the capacitor further comprises side surfaces joining the top and bottom surfaces, and the area of each of the top and bottom surfaces is greater than the area of any one side surface.
7. The capacitor of claim 6 , wherein at least one of the length and width of the top and bottom surfaces is greater than a thickness of the capacitor.
8. The capacitor of claim 7 , wherein the length and width are less than or equal to 0.090″.
9. The capacitor of claim 6 , wherein the electrically isolated metallization pad is formed entirely on the top or bottom surface.
10. The capacitor of claim 1 , wherein the electrically isolated metallization pad is formed in parallel with a main surface of the internal electrode.
11. The capacitor of claim 1 , wherein the capacitor has only a single active capacitive layer.