IP Library Granted Patent US 9,538,588
Granted Patent B2
US 9,538,588 · App. 14/861,403 · Granted Jan 3, 2017

Encapsulation of light-emitting elements on a display module

Inventors: Shannon Lee Mutschelknaus (Aurora, SD); Jordan Gab (Brookings, SD); Nathan Lane Nearman (Brookings, SD); Ryan J. Nielsen (Brookings, SD)
Assignee: Daktronics, Inc.
H05B33/04F21V19/002F21V23/005G09F9/3026G09F9/33G09F27/008H04N9/30F21Y2105/001F21Y2105/10F21Y2115/10
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Quick Facts
Patent No.
US 9,538,588
App. No.
14/861,403
Granted
Jan 3, 2017
Kind
B2
Abstract

A video display module comprises a circuit board having a front face, a plurality of light-emitting elements electrically coupled to the front face of the circuit board, and a polymer encapsulating member adhered to the front face of the circuit board, the polymer encapsulating member substantially covering at least a portion of the circuit board and a portion of the plurality of light-emitting elements, the polymer encapsulating member substantially sealing the portion of the circuit board and the portion of the plurality of light-emitting elements.

Claims (27)

1. A video display module comprising:

a circuit board having a front face;

a plurality of light-emitting elements mounted to the front face of the circuit board;

one or more electronic components mounted to the circuit board; and

a polymer encapsulating member bonded to and substantially covering at least a portion of the circuit board, at least a portion of each of the plurality of light-emitting elements, and at least a portion of each of the one or more electronic components, wherein the polymer encapsulating member substantially seals the portion of the circuit board, the portion of each of the plurality of light-emitting elements, and the portion of each of the one or more electronic components.

2. The video display module of claim 1 , wherein the polymer encapsulating member has a profile that substantially corresponds to a mating profile of the portion of the circuit board and the of each of the plurality of light-emitting elements.

3. The video display module of claim 1 , wherein at least one of the portion of the circuit board, the portion of each of the plurality of light-emitting elements, or the portion of each of the one or more electronic components is treated to promote bonding between the polymer encapsulating member and the treated portion of the circuit board, the treated portion of the plurality of light-emitting elements, or the treated portion of the one or more electronic components.

4. The video display module of claim 3 , wherein at least one of the portion of the circuit board, the portion of each of the plurality of light-emitting elements, or the portion of each of the one or more electronic components is treated by at least one of plasma treating, flame treating, or application of a primer thereto.

5. The video display module of claim 1 , wherein the plurality of light-emitting elements comprises surface-mounted light-emitting elements.

6. The video display module of claim 1 , wherein at least a portion of the polymer encapsulating member over each of the plurality of light-emitting elements is substantially transparent to visible light.

7. The video display module of claim 1 , further comprising a louver mounted over the polymer encapsulating member.

8. The video display module of claim 1 , wherein the circuit board comprises a rear face opposing the front face and an edge along one or more sides extending rearward from the front face toward the rear face, wherein the polymer encapsulating member covers and is bonded to substantially all of the front face, substantially all of the edge, and substantially all of the rear face.

9. The video display module of claim 8 , wherein the front face, the edge, and the rear face of the circuit board are treated to promote adhesion between the polymer encapsulating member and the front face and the rear face.

10. The video display module of claim 1 , wherein the polymer encapsulating member comprises a silicone or polyurethane material.

11. A video display module comprising:

a circuit board having a front face;

a plurality of light-emitting elements electrically coupled to the front face of the circuit board; and

a polymer encapsulating member molded or casted onto the circuit board so that the polymer encapsulating member substantially covering at least a portion of the circuit board and substantially the entirety of exposed surfaces of each of the plurality of light-emitting elements, the polymer encapsulating member substantially sealing the portion of the circuit board and substantially the entirety of the exposed surfaces of each of the plurality of light-emitting elements.

12. The video display module of claim 11 , wherein at least one of the portion of the circuit board or substantially the entirety of the exposed surfaces of each of the plurality of light-emitting elements is treated to promote bonding between the polymer encapsulating member and the portion of the circuit board or substantially the entirety of the exposed surfaces of the plurality of light-emitting elements.

13. The video display module of claim 12 , wherein at least one of the portion of the circuit board or substantially the entirety of the exposed surfaces of each of the plurality of light-emitting elements is treated by at least one of plasma treating, flame treating, and application of a primer thereto.

14. The video display module of claim 11 , wherein the plurality of light-emitting elements comprises surface-mounted light-emitting elements.

15. The video display module of claim 11 , wherein at least a portion of the polymer encapsulating member over each of the plurality of light-emitting elements is substantially transparent to visible light.

16. The video display module of claim 11 , further comprising a louver mounted over the polymer encapsulating member.

17. The video display module of claim 11 , wherein the circuit board comprises a rear face opposing the front face and an edge along one or more sides extending rearward from the front face toward the rear face, wherein the polymer encapsulating member covers and is bonded to substantially all of the front face, substantially all of the edge, and substantially all of the rear face.

18. The video display module of claim 17 , wherein the front face, the edge, and the rear face of the circuit board are treated to promote adhesion between the polymer encapsulating member and the front face and the rear face.

19. The video display module of claim 11 , wherein the polymer encapsulating member comprises a silicone or polyurethane material.

20. The video display module of claim 1 , wherein the polymer encapsulating member is bonded to and covers substantially the entirety of exposed surfaces of each of the plurality of light-emitting elements and of each of the one or more electronic components, and wherein the polymer encapsulating member substantially seals the exposed surfaces of each of the plurality of light-emitting elements and of each of the one or more electronic components.

Assignments (3)
SECURITY INTEREST Recorded Dec 4, 2025
From: DAKTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 073836/0756 →
SECURITY INTEREST Recorded May 11, 2023
From: DAKTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063622/0039 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2016
From: MUTSCHELKNAUS, SHANNON LEE; GAB, JORDAN; NEARMAN, NATHAN LANE; NIELSEN, RYAN J
To: DAKTRONICS, INC.
Reel/Frame 040372/0894 →
Continuity (3)
Continuation 14095584 · Dec 3, 2013
Provisional Application 61735346 · Dec 10, 2012
Related Publication 20160014854A1 · Jan 14, 2016