IP Library Granted Patent US 10,011,000
Granted Patent B1
US 10,011,000 · App. 14/864,152 · Granted Jul 3, 2018

Leached superabrasive elements and systems, methods and assemblies for processing superabrasive materials

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Quick Facts
Patent No.
US 10,011,000
App. No.
14/864,152
Granted
Jul 3, 2018
Kind
B1
Abstract

A method of processing a polycrystalline diamond material includes exposing at least a portion of a polycrystalline diamond material to a processing solution, the polycrystalline diamond material including a metallic material disposed in interstitial spaces defined within the polycrystalline diamond material. The method includes exposing an electrode to the processing solution, applying a positive charge to the polycrystalline diamond material, and applying a negative charge to the electrode. An assembly for processing a polycrystalline diamond body includes a polycrystalline diamond body and an electrode that are in electrical communication with a volume of processing solution, and a power source configured to apply a positive charge to the polycrystalline diamond body and a negative charge to the electrode.

Claims (86)

1. A method of processing a polycrystalline diamond material, the method comprising:

exposing at least a portion of a polycrystalline diamond material to a processing solution, the polycrystalline diamond material comprising a metallic material disposed in interstitial spaces defined within the polycrystalline diamond material;

exposing an electrode to the processing solution;

applying a positive charge to the polycrystalline diamond material;

applying a negative charge to the electrode.

2. The method of claim 1 , wherein the processing solution leaches the metallic material from interstitial spaces within at least a volume of the polycrystalline diamond material.

3. The method of claim 2 , wherein the rate at which the processing solution leaches the metallic material from the interstitial spaces within at least the volume of the polycrystalline diamond material is increased in the presence of an electrical current between the polycrystalline diamond material and the electrode.

4. The method of claim 1 , wherein the electrode is disposed near at least the portion of the polycrystalline diamond material.

5. The method of claim 1 , wherein the electrode does not directly contact the polycrystalline diamond material.

6. The method of claim 1 , wherein the processing solution at least partially oxidizes the metallic material.

7. The method of claim 1 , wherein the processing solution comprises an aqueous electrolyte solution.

8. The method of claim 7 , wherein the processing solution comprises the electrolytes at a molar concentration of between approximately 0.01 M and approximately 3 M.

9. The method of claim 1 , wherein the processing solution comprises at least one of:

acetic acid;

ammonium chloride;

arsenic acid;

ascorbic acid;

carboxylic acid;

citric acid;

formic acid;

hydrobromic acid;

hydrofluoric acid;

hydroiodic acid;

lactic acid;

malic acid;

nitric acid;

oxalic acid;

phosphoric acid;

propionic acid;

pyruvic acid;

succinic acid;

tartaric acid.

10. The method of claim 1 , wherein the processing solution comprises at least one of an ion, a salt, and an ester of at least one of:

acetic acid;

ammonium chloride;

arsenic acid;

ascorbic acid;

carboxylic acid;

citric acid;

formic acid;

hydrobromic acid;

hydrofluoric acid;

hydroiodic acid;

lactic acid;

malic acid;

nitric acid;

oxalic acid;

phosphoric acid;

propionic acid;

pyruvic acid;

succinic acid;

tartaric acid.

11. The method of claim 1 , wherein the electrode comprises at least one of:

copper;

tungsten carbide;

cobalt;

zinc;

iron;

platinum;

palladium;

niobium;

graphite;

graphene;

nichrome;

gold;

silver.

12. The method of claim 1 , wherein the metallic material disposed in the interstitial spaces defined within the polycrystalline diamond material comprises at least one of:

cobalt;

nickel;

iron;

tungsten.

13. The method of claim 1 , wherein the processing solution comprises a metal salt.

14. The method of claim 1 , wherein a masking layer is disposed over at least a portion of the polycrystalline diamond material.

15. The method of claim 1 , wherein a cation of the metallic material is present in the processing solution following application of the positive charge to the polycrystalline diamond material and application of the negative charge to the electrode.

16. The method of claim 1 , wherein the cation of the metallic material is reduced and electrodeposited on the electrode.

17. The method of claim 1 , wherein the processing solution comprises a first processing solution;

further comprising exposing at least the portion of the polycrystalline diamond material to a second processing solution.

18. The method of claim 17 , wherein the second processing solution is more acidic than the first processing solution.

19. The method of claim 17 , wherein at least the portion of the polycrystalline diamond material is exposed to the second processing solution following exposure of at least the portion of the polycrystalline diamond material to the first processing solution.

20. The method of claim 17 , wherein at least the portion of the polycrystalline diamond material is exposed to the second processing solution prior to exposure of at least the portion of the polycrystalline diamond material to the first processing solution.

21. The method of claim 1 , wherein an electrode for applying the positive charge abuts the polycrystalline diamond material.

22. The method of claim 1 , wherein:

the polycrystalline diamond material comprises a polycrystalline diamond table;

the polycrystalline diamond table is bonded to a substrate.

23. The method of claim 22 , wherein applying the positive charge to the polycrystalline diamond material comprises applying the positive charge to the polycrystalline diamond table.

24. The method of claim 23 , wherein the positive charge is applied to the polycrystalline diamond table via the substrate.

Assignments (5)
SECURITY INTEREST Recorded Jul 18, 2025
From: US SYNTHETIC CORPORATION
To: KEYBANK NATIONAL ASSOCIATION
Reel/Frame 074973/0089 →
RELEASE OF SECURITY INTEREST Recorded Jun 7, 2022
From: BANK OF AMERICA, N.A.
To: ACE DOWNHOLE, LLC; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; APERGY BMCS ACQUISITION CORP.; NORRISEAL-WELLMARK, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
Reel/Frame 060305/0001 →
SECURITY INTEREST Recorded Jun 5, 2020
From: ACE DOWNHOLE, LLC; APERGY BMCS ACQUISITION CORP.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053790/0001 →
SECURITY AGREEMENT Recorded May 9, 2018
From: APERGY (DELAWARE) FORMATION, INC.; APERGY BMCS ACQUISITION CORP.; APERGY ENERGY AUTOMATION, LLC; HARBISON-FISCHER, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 046117/0015 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2015
From: HEATON, DAREN NATHANIEL; LYNN, JEREMY BRETT; CHAPMAN, MARK PEHRSON; BOND, OAKLEY D.
To: US SYNTHETIC CORPORATION
Reel/Frame 036649/0240 →