System for thermal cycling of microfluidic samples
View Patent ↗A thermal cycler for a microfluidic device includes a controller operable to provide a series of electrical signals, a heat sink, and a heating element in thermal communication with the heat sink and operable to receive the series of electrical signals from the controller. The thermal cycler also includes a thermal chuck in thermal communication with the heating element. The thermal chuck comprises a heating surface operable to make thermal contact with the microfluidic device. The heating surface is characterized by a temperature ramp rate between 2.5 degrees Celsius per second and 5.5 degrees Celsius per second and a temperature difference between a first portion of the heating surface supporting a first portion of the microfluidic device and a second portion of the heating surface supporting a second portion of the microfluidic device is less than 0.25° C.
1. A thermal cycler for a microfluidic device, the thermal cycler comprising:
a controller operable to provide a series of electrical signals;
a heat sink comprising a plurality of radiator pins;
a heating element in thermal communication with the heat sink and operable to receive the series of electrical signals from the controller, wherein the heating element comprises one or more of a central thermal electric cooler and one or more of a perimeter heater; and
a thermal chuck in thermal communication with the heating element, wherein the thermal chuck comprises a heating surface operable to make thermal contact with the microfluidic device.
2. The thermal cycler of claim 1 the microfluidic device includes a plurality of reaction chambers.
3. The thermal cycler of claim 2 wherein the plurality of reaction chambers comprise 2,304 reaction chambers.
4. The thermal cycler of claim 3 wherein the plurality of reaction chambers comprise 9,216 reaction chambers.
5. A thermal cycler for a microfluidic device having a plurality of reaction chambers extending over a predetermined area in a lateral plane, the thermal cycler comprising:
a controller operable to provide a series of electrical signals;
a heat sink comprising a plurality of radiator pins;
a heating element in thermal communication with the heat sink and operable to receive the series of electrical signals from the controller, wherein the heating element comprises one or more of a central thermal electric cooler and one or more of a perimeter heater; and
a thermal chuck in thermal communication with the heating element, wherein the thermal chuck comprises a heating surface operable to make thermal contact with the microfluidic device wherein a temperature difference between a first portion of the heating surface supporting a first portion of the microfluidic device and a second portion of the heating surface supporting a second portion of the microfluidic device is less than 0.25° C.
6. The thermal cycler of claim 5 wherein the first portion of the microfluidic device and the second portion of the microfluidic device are separated by more than 40 mm in the lateral plane.
7. The thermal cycler of claim 6 wherein the first portion of the microfluidic device and the second portion of the microfluidic device are separated by more than 48 mm in the lateral plane.
8. The thermal cycler of claim 5 wherein the first portion of the microfluidic device is located at a first corner of the predetermined area and the second portion of the microfluidic device is located at a second corner of the predetermined area.
9. The thermal cycler of claim 5 wherein the plurality of reaction chambers comprise at least 500 reaction chambers.
10. The thermal cycler of claim 9 wherein the plurality of reaction chambers comprise 2,304 reaction chambers.
11. The thermal cycler of claim 9 wherein the plurality of reaction chambers comprise 9,216 reaction chambers.
12. The thermal cycler of claim 1 wherein the heating surface is characterized by a temperature ramp rate between 2.5 degrees Celsius per second and 5.5 degrees Celsius per second.
13. The thermal cycler of claim 1 wherein the heat sink further comprises a heat sink sensor.
14. The thermal cycler of claim 1 wherein the thermal cycler further comprises a first thermal pad positioned between the heat sink and the heating element.
15. The thermal cycler of claim 1 wherein the thermal cycler further comprises a second thermal pad positioned between the heating element and the thermal chuck.
16. The thermal cycler of claim 1 wherein at least one resistance temperature detector (RTD) is in thermal contact with the thermal chuck.
17. The thermal cycler of claim 5 wherein the heat sink further comprises a heat sink sensor.
18. The thermal cycler of claim 5 wherein the thermal cycler further comprises a first thermal pad positioned between the heat sink and the heating element.
19. The thermal cycler of claim 5 wherein the thermal cycler further comprises a second thermal pad positioned between the heating element and the thermal chuck.
20. The thermal cycler of claim 5 wherein at least one resistance temperature detector (RTD) is in thermal contact with the thermal chuck.