IP Library Granted Patent US 10,322,936
Granted Patent B2
US 10,322,936 · App. 14/864,642 · Granted Jun 18, 2019

High purity polysilocarb materials, applications and processes

Inventors: Douglas M. Dukes (Troy, NY); Ashish P. Diwanji (New Albany, OH); Andrew R. Hopkins (Sylvania, OH); Walter J. Sherwood (Glenville, NY); Glenn Sandgren (Ambler, PA); Mark S. Land (Houston, TX); Brian L. Benac (Hadley, NY)
Assignee: Pallidus, Inc.
C01B31/301C04B35/56C04B35/5603C04B35/571C04B35/806C08G77/20C08G77/50C08L83/04C04B2235/3418C04B2235/3826C04B2235/44C04B2235/48C04B2235/483C04B2235/528C04B2235/5427C04B2235/5436C04B2235/6581C04B2235/72C04B2235/77C04B2235/96C08G77/12C08G77/80C09K8/80
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Quick Facts
Patent No.
US 10,322,936
App. No.
14/864,642
Granted
Jun 18, 2019
Kind
B2
Abstract

Organosilicon chemistry, polymer derived ceramic materials, and methods. Such materials and methods for making polysilocarb (SiOC) and Silicon Carbide (SiC) materials having 3-nines, 4-nines, 6-nines and greater purity. Processes and articles utilizing such high purity SiOC and SiC.

Claims (12)

1. A high purity SiOC composition consisting essentially of: 1% to 99% silicon, 1% to 99% carbon and 1% to 99% oxygen; and wherein the composition is substantially free from impurities, whereby the composition is at last 99.99% pure; and having a molar ratio of about 30%to 85% carbon, about 5% to 40% oxygen, and about 5% to 35% silicon.

2. A high purity SiOC composition consisting essentially of: 1% to 99% silicon, 1% to 99% carbon and 1% to 99% oxygen; and wherein the composition is substantially free from impurities, whereby the composition is at last 99.99% pure; and having a molar ratio of about 50% to 65% carbon, about 20% to 30% oxygen, and about 15% to 20% silicon.

3. A high purity SiOC cured material comprising: silicon, carbon and oxygen; a molar ratio of about 30% to 85% carbon, about 5% to 40% oxygen, and about 5% to 35% silicon; and wherein the composition has less than 10 ppm of Al, less than 10 ppm B, and less than 10 ppm N.

4. A high purity SiOC cured material comprising: silicon, carbon and oxygen; a molar ratio of about 30% to 85% carbon, about 5% to 40% oxygen, and about 5% to 35% silicon; and wherein the composition has less than 1 ppm of A1, less than 1 ppm B, and less than 1 ppm N.

5. A high purity SiOC cured material comprising: silicon, carbon and oxygen; a molar ratio of about 30% to 85% carbon, about 5% to 40% oxygen, and about 5% to 35% silicon; and wherein the composition has less than 10 ppm of A1,less than 10 ppm B, less than 10 ppm Na.

6. A high purity SiOC cured material comprising: silicon, carbon and oxygen; a molar ratio of about 30% to 85% carbon, about 5% to 40% oxygen, and about 5% to 35% silicon; and wherein the composition has less than 1 ppm of A1, less than 1 ppm B, less than 1 ppm Na.

7. A high purity SiOC cured material comprising: silicon, carbon and oxygen; a molar ratio of about 30% to 85% carbon, about 5% to 40% oxygen, and about 5% to 35% silicon; and wherein the composition has less than 10 ppm of A1,less than 10 ppm B, less than 10 ppm P.

8. A high purity SiOC cured material comprising: silicon, carbon and oxygen; a molar ratio of about 30% to 85% carbon, about 5% to 40% oxygen, and about 5% to 35% silicon; and wherein the composition has less than 1 ppm of A1, less than 1 ppm B, less than 1 ppm P.

9. A high purity SiOC cured material comprising: silicon, carbon and oxygen; a molar ratio of about 30% to 85% carbon, about 5% to 40% oxygen, and about 5% to 35% silicon; and wherein the composition has less than a total of 1 ppm of A1, B, and P.

10. A high purity SiOC cured material comprising: silicon, carbon and oxygen; a molar ratio of about 30% to 85% carbon, about 5% to 40% oxygen, and about 5% to 35% silicon; and wherein the composition has less than a total of 10 ppm of A1, B, and P.

11. A high purity SiOC cured material comprising: silicon, carbon and oxygen; a molar ratio of about 30% to 85% carbon, about 5% to 40% oxygen, and about 5% to 35% silicon; and wherein the composition has less than a total of 10 ppm of A1, B, N, Na, and P.

12. A high purity SiOC cured material comprising: silicon, carbon and oxygen; a molar ratio of about 30% to 85% carbon, about 5% to 40% oxygen, and about 5% to 35% silicon; and wherein the composition has less than a total of 10 ppm of A1, B, Fe, Na, and P.

Assignments (3)
SECURITY INTEREST Recorded Jan 10, 2025
From: PALLIDUS, INC.
To: R&R PALLIDUS HOLDINGS II LLC, AS ADMINISTRATIVE AGENT
Reel/Frame 069818/0486 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2018
From: MELIOR INNOVATIONS, INC.
To: PALLIDUS, INC.
Reel/Frame 045685/0773 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2018
From: DIWANJI, ASHISH P; HOPKINS, ANDREW R; SHERWOOD, WALTER J; DUKES, DOUGLAS M; SANDGREN, GLENN; LAND, MARK S; BENAC, BRIAN L
To: MELIOR INNOVATIONS, INC.
Reel/Frame 044825/0603 →
Continuity (11)
Continuation In Part 14268150 · May 2, 2014
Continuation In Part 14634814 · Feb 28, 2015
Continuation In Part 14212896 · Mar 14, 2014
Provisional Application 62055397 · Sep 25, 2014
Provisional Application 62055461 · Sep 25, 2014
Provisional Application 62055497 · Sep 25, 2014
Provisional Application 62112025 · Feb 4, 2015
Provisional Application 61818906 · May 2, 2013
Provisional Application 61818981 · May 3, 2013
Provisional Application 61946598 · Feb 28, 2014
Related Publication 20160207781A1 · Jul 21, 2016
Cited By (1)
US 12,330,948