Elongated lighting device with marks for cutting to length and method
View Patent ↗A lighting device includes an elongated support member, a plurality of light sources, at least one electrically conductive layer for interconnecting the light sources, and covering layer provided over the light source and conductive layer, the covering layer having discontinuities defining a marker array for cutting to length the lighting device.
1. A modular lighting device configured to be cut to length, comprising:
an elongated printed circuit board having a front side with a first electrically conductive layer covered with a first covering layer, and a back side with a second electrically conductive layer covered with a second covering layer, said second covering layer exhibits discontinuities forming a marker array for cutting to length the modular lighting device;
a plurality of electrically powered light radiation sources mounted on the front side and not on the back side; and
a light permeable layer extending over said second covering layer and said discontinuities.
2. The lighting device of claim 1 , wherein said second covering layer with said discontinuities is arranged facing outside the device, whereby said discontinuities forming the marker array are visible from outside the device.
3. The lighting device of claim 1 , wherein said at least one of the first or the second electrically conductive layer includes a copper layer.
4. A method of producing a modular lighting device, comprising:
providing an elongated printed circuit board having a front side and a back side;
providing a first electrically conductive layer covered with a first covering layer on the front side,
providing a second electrically conductive layer covered with a second covering layer on the backside, wherein said second covering layer exhibits regularly spaced discontinuities forming a marker array for cutting to length said modular lighting device,
arranging a plurality of electrically powered light radiation sources on the front side of the elongated printed circuit board and not on the backside,
and
providing a light permeable layer extending over said second covering layer and said discontinuities.
5. The method of claim 4 , further comprising providing said second covering layer with said discontinuities facing to the exterior of the device, whereby said discontinuities forming the marker array are visible from outside the device.