IP Library Patent Application 14866029
Patent Application
App. No. 14/866,029

INFRARED CUT FILTER

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Quick Facts
Patent No.
US None
App. No.
14/866,029
Abstract

An infrared cut filter is disclosed. This filter includes a transparent substrate and one or more infrared absorbing layers containing an infrared absorbing compound on at least one principal surface of the transparent substrate, wherein a transmittance at a wavelength of 1200 nm measured in a stack composed of the transparent substrate and the one or more infrared absorbing layers is 10% or less.

Claims (25)

1 . An infrared cut filter comprising a transparent substrate and one or more infrared absorbing layers on at least one principal surface of the transparent substrate,

wherein the infrared absorbing layer is a layer containing an organic dye or an inorganic particle in a transparent resin or a layer composed of an inorganic particle, and

wherein a transmittance at a wavelength of 1200 nm measured in a stack composed of the transparent substrate and the one or more infrared absorbing layers is 10% or less.

2 . The infrared cut filter according to claim 1 ,

wherein the transparent substrate is a glass substrate.

3 . The infrared cut filter according to claim 2 ,

wherein the glass substrate is a copper-containing glass substrate using phosphate glass or fluorophosphate glass as a base material and containing copper in the base material.

4 . The infrared cut filter according to claim 1 ,

wherein the organic dye is at least one selected from a group consisting of a diimonium-based compound, a squarylium-based compound, a dithiolene metal complex-based compound, a mercaptophenol metal complex-based compound, a mercaptonaphthol metal complex-based compound, and an aminium-based compound.

5 . The infrared cut filter according to claim 4 ,

wherein the organic dye comprises a diimonium-based compound.

6 . The infrared cut filter according to claim 1 ,

wherein the inorganic particle is at least one selected from a group consisting of a sodium tungstate particle, a potassium tungstate particle, a rubidium tungstate particle, and a cesium tungstate particle.

7 . The infrared cut filter according to claim 6 ,

wherein the inorganic particle is a cesium tungstate particle.

8 . The infrared cut filter according to claim 1 ,

wherein the transparent resin comprises a polyester resin.

9 . The infrared cut filter according to claim 8 ,

wherein the polyester resin contains 1 to 10 mol % of structural units derived from an aliphatic dicarboxylic acid.

10 . The infrared cut filter according to claim 1 , further comprising

a dielectric multilayered film formed on at least one principal surface of the transparent substrate.

11 . The infrared cut filter according to claim 1 , further comprising

one or more near-infrared absorbing layers containing a near-infrared absorbing compound, on at least one principal surface of the transparent substrate.

12 . The infrared cut filter according to claim 1 , further comprising

an anti-reflection film constituting an uppermost surface on at least one principal surface of the transparent substrate.

Assignments (2)
CHANGE OF NAME Recorded Aug 7, 2018
From: ASAHI GLASS COMPANY, LIMITED
To: AGC INC.
Reel/Frame 046730/0786 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2015
From: HIRAKOSO, HIDEYUKI; KUMAI, HIROSHI; ITO, WAKAKO; KASHIWABARA, SATOSHI
To: ASAHI GLASS COMPANY, LIMITED
Reel/Frame 036660/0821 →