IP Library Patent Application 14866161
Patent Application
App. No. 14/866,161

COMPOSITIONS INCORPORATING DIELECTRIC ADDITIVES FOR PARTICLE FORMATION, AND METHODS OF PARTICLE FORMATION USING SAME

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Patent No.
US None
App. No.
14/866,161
Abstract

A method of forming particles that includes performing a strong force attenuation of a mixture to form pre-particles. The mixture including a base compound and a dielectric additive having an elevated dielectric constant dispersed therein. The pre-particles are then dielectrically spun in an electrostatic field to further attenuate the pre-particles and form the particles.

Claims (91)

1 .- 9 . (canceled)

10 . A composition for particle formation, comprising:

a base compound; and

a dielectric additive selected to encourage dielectrophoretic attenuation of the base compound during dielectric spinning.

11 . The composition of claim 10 , wherein the dielectric additive includes a mild dielectric additive having a dielectric constant above 5.

12 . The composition of claim 10 , wherein the dielectric additive includes a moderate dielectric additive having a dielectric constant above 10

13 . The composition of claim 10 , wherein the dielectric additive includes a strong dielectric additive having a dielectric constant above 100.

14 . The composition of claim 10 , wherein the dielectric additive includes polyglycerol-3.

15 . The composition of claim 10 , wherein the dielectric additive includes titanium dioxide (TiO 2 ).

16 . The composition of claim 10 , wherein the dielectric additive includes barium titanate.

17 . The composition of claim 10 , wherein the dielectric additive includes a ceramic dielectric.

18 . The composition of claim 10 , wherein the dielectric additive includes high-relative permittivity nanoparticles dispersed within the base compound.

19 . The composition of claim 10 , further comprising a dispersant selected to aid in dispersing the dielectric additive within the base compound.

20 . The composition of claim 19 , wherein the dispersant includes sodium stearate.

21 . The composition of claim 19 , wherein the dispersant includes sodium oleate.

22 . The composition of claim 19 , wherein the dispersant includes stearic acid.

23 . The composition of claim 10 , further comprising a viscosity-reduction additive selected to reduce the viscosity of the base compound.

24 . The composition of claim 23 , wherein the viscosity-reduction additive includes Irgatec CR-76.

25 . The composition of claim 23 , wherein the viscosity-reduction additive includes peroxide.

26 . The composition of claim 10 , further comprising a conductivity additive.

27 . The composition of claim 10 , further comprising an ionic liquid.

28 . The composition of claim 27 , wherein the ionic liquid is mixed with the dielectric additive.

29 . The composition of claim 10 , wherein a conductive additive is mixed with the dielectric additive.

30 . The composition of claim 10 , wherein the composition is substantially solvent-free.

31 . The composition of claim 10 , comprising 85 to 99% by weight base compound, and 0.5 to 20% by weight dielectric additive.

32 . The composition of claim 10 , comprising 0 to 5% by weight dispersant.

33 . The composition of claim 10 , comprising 0 to 10% by weight viscosity-reduction additive.

34 . The composition of claim 10 , wherein the base compound is a polymer.

35 . The composition of claim 34 , wherein the polymer is a thermoplastic polymer.

36 . The composition of claim 10 , wherein the base compound is selected from a group consisting of:

a. polyethylene;

b. polypropylene;

c. polycaprolactone;

d. co-polymers of polyethylene-acrylic acid

e. polyacrylonitrile;

f. polyamides;

g. polybutadiene;

h. polycarbonate;

i. polychloroprene;

j. polychlorotrifluoroethylene;

k. poly(ethylene terephthalate);

l. polyisoprene;

m. poly(methyl methacrylate);

n. polyoxymethylene;

o. poly(phenylene oxide);

p. polystyrene;

q. polysulfones;

r. polytetrafluoroethylene;

s. poly(vinyl acetate);

t. poly(vinyl chloride);

u. polyester;

v. wax;

w. polypyrrole;

x. polyaniline;

y. poly(vinylidene chloride);

z. poly(vinylidene fluoride);

aa. co-polymers; and

bb. blends.

37 . The composition of claim 10 , wherein the base compound is selected from the group consisting of:

a. liquid polymers;

b. molten glasses;

c. molten metals;

d. molten salts;

e. minerals;

f. ceramics;

g. pure liquid substances;

h. suspensions;

i. emulsions;

j. colloids;

k. latex;

l. solutions; and

m. mixtures.

38 . The composition of claim 19 , wherein the dispersant is selected from the group consisting of:

a. sodium stearate; and

b. sodium oleate.

39 . The composition of claim 10 , wherein the dielectric additive is selected from the group consisting of:

a. polyglycol;

b. glycol;

c. mannitol;

d. ionic liquid;

e. polycaprolactone;

f. polyglycerol;

g. glycerol;

h. titanium dioxide; and

i. barium titanate.

40 . The composition of claim 10 , wherein the viscosity-reduction additive is selected from the group consisting of:

a. Irgatec CR-76;

b. peroxides;

c. waxes; and

d. lubricants.

41 .- 60 . (canceled)

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2015
From: TINDALE, JOCELYN; GERAKOPULOS, RYAN J.; ANGAMMANA, CHITRAL; LAZAREVA, TATIANA
To: GABAE TECHNOLOGIES, LLC
Reel/Frame 036661/0273 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2015
From: KOSLOW, EVAN
To: KOSLOW TECHNOLOGIES CORPORATION CHARITABLE REMAINDER TRUST
Reel/Frame 036661/0335 →