Compositions incorporating dielectric additives for particle formation, and methods of particle formation using same
View Patent ↗A method of forming particles that includes performing a strong force attenuation of a mixture to form pre-particles. The mixture including a base compound and a dielectric additive having an elevated dielectric constant dispersed therein. The pre-particles are then dielectrically spun in an electrostatic field to further attenuate the pre-particles and form the particles.
1. A method of forming particles, comprising:
a. adding a dielectric additive to a base compound to form a mixture;
b. dielectrically spinning the mixture to form the particles; and
c. further comprising mechanically attenuating the base compound before dielectrically spinning the mixture,
wherein the mechanical attenuation is performed using at least one rotating surface.
2. The method of claim 1 , wherein mechanically attenuating the base compound forms particles larger than one micron, and the dielectric spinning forms particles smaller than one micron.
3. The method of claim 1 , wherein the mechanical attenuation forms particles less than 12 microns in diameter.
4. The method of claim 1 , wherein the mechanical attenuation forms particles less than 20 microns in diameter.
5. The method of claim 1 , wherein the base compound is a polymer.
6. The method of claim 5 , further comprising melting the polymer to form a liquid polymer melt, then electrospinning the liquid polymer melt to form polymer particles.
7. The method of claim 6 , wherein the dielectric additives are added to the polymer before melting the polymer.
8. The method of claim 6 , wherein the dielectric additives are added to the polymer after melting the polymer.
9. The method of claim 1 , further comprising adding a dispersant selected to encourage the dielectric additive to disperse within the base compound.
10. The method of claim 9 , further comprising mixing the dispersant and dielectric additive before the dielectric additive is combined with other ingredients.
11. The method of claim 10 , wherein the dispersant and dielectric additive are mixed, then combined with the base compound, and then mixed prior to melting the base compound.
12. The method of claim 10 , wherein the dispersant and dielectric additive are mixed, then combined with the base compound, and then mixed after melting the base compound.
13. The method of claim 1 , further comprising adding a viscosity reducing additive to base compound.
14. The method of claim 1 , wherein the particles include fibers.
15. The method of claim 1 , wherein the particles include droplets.
16. The method of claim 1 , wherein the base compound is selected from the group consisting of:
a. liquid polymers;
b. molten glasses;
c. molten metals;
d. molten salts;
e. minerals;
f. ceramics;
g. pure liquid substances;
h. suspensions;
i. emulsions;
j. colloids;
k. latex;
I. solutions; and
m. mixtures.
17. The method of claim 1 , further comprising adding at least one additional compound.
18. The method of claim 17 , wherein the at least one additional compound is selected from the group consisting of:
a. carbon;
b. activated carbon;
c. super absorbent polymers;
d. zeolites;
e. bentonite;
f. kaolin;
g. diatomaceous earth
h. chopped fibers;
i. ion exchange resins;
j. polytetrafluoroethylene (PTFE) powder;
k. adsorbents;
I. absorbents;
m. silicates;
n. aluminas;
o. minerals;
p. ceramics;
q. glass; and
r. beads.
19. A method of forming particles, comprising:
a. adding a dielectric additive to a base compound to form a mixture; and
b. dielectrically spinning the mixture to form the particles,
c. wherein the base compound is a polymer, and
d. further comprising melting the polymer to form a liquid polymer melt, then electrospinning the liquid polymer melt to form polymer particles.
20. The method of claim 19 , wherein the dielectric additives are added to the polymer before melting the polymer.
21. The method of claim 19 , wherein the dielectric additives are added to the polymer after melting the polymer.
22. A method of forming particles, comprising:
a. adding a dielectric additive to a base compound to form a mixture;
b. dielectrically spinning the mixture to form the particles;
c. further comprising adding a dispersant selected to encourage the dielectric additive to disperse within the base compound; and
d. mixing the dispersant and dielectric additive before the dielectric additive is combined with other ingredients.
23. The method of claim 22 , wherein the dispersant and dielectric additive are mixed, then combined with the base compound, and then mixed prior to melting the base compound.
24. The method of claim 22 , wherein the dispersant and dielectric additive are mixed, then combined with the base compound, and then mixed after melting the base compound.
25. A method of forming particles, comprising:
a. adding a dielectric additive to a base compound to form a mixture;
b. dielectrically spinning the mixture to form the particles; and
c. further comprising adding a viscosity reducing additive to base compound.