IP Library Granted Patent US 9,695,287
Granted Patent B2
US 9,695,287 · App. 14/867,861 · Granted Jul 4, 2017

Curable organo polysiloxane composition, encapsulant, and electronic device

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Quick Facts
Patent No.
US 9,695,287
App. No.
14/867,861
Granted
Jul 4, 2017
Kind
B2
Abstract

A curable organo polysiloxane composition, an encapsulant, and an electronic device, the composition including at least one compound represented by the following Chemical Formula 1 and having a number average molecular weight of less than about 4,000, at least one first siloxane compound including a silicon-bonded hydrogen; and at least one second siloxane compound including a silicon-bonded alkenyl group:

Claims (51)

1. A curable organo polysiloxane composition, comprising:

at least one compound represented by the following Chemical Formula 1 and having a number average molecular weight of less than about 4,000,

at least one first siloxane compound including a silicon-bonded hydrogen; and

at least one second siloxane compound including a silicon-bonded alkenyl group:

wherein, in Chemical Formula 1,

A is selected from a substituted or unsubstituted C1 to C21 alkylene group, a substituted or unsubstituted C3 to C12 cycloalkylene group, a substituted or unsubstituted C6 to C30 heterocycloalkylene group, a substituted or unsubstituted C2 to C20 alkenylene group, a substituted or unsubstituted C2 to C20 alkynylene group, a substituted or unsubstituted C6 to C30 arylene group, a substituted or unsubstituted C2 to C30 heteroarylene group, or a combination thereof,

R 1 to R 8 are each independently selected from hydrogen, a substituted or unsubstituted C1 to C21 alkyl group, a substituted or unsubstituted C7 to C20 arylalkyl group, a substituted or unsubstituted C1 to C20 heteroalkyl group, a substituted or unsubstituted C3 to C12 cycloalkyl group, a substituted or unsubstituted C2 to C20 heterocycloalkyl group, a substituted or unsubstituted C2 to C20 alkenyl group, a substituted or unsubstituted C2 to C20 alkynyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C1 to C10 alkoxy group, a substituted or unsubstituted C1 to C30 acyl group, a hydroxy group, a halogen, or a combination thereof, two or more of R 1 to R 8 being a substituted or unsubstituted C2 to C20 alkenyl group,

m is an integer of 0 to 5, and

n is an integer of 1 to 10,

wherein the at least one first siloxane compound includes a compound represented by the following Chemical Formula 5:

(R 9 R 10 R 11 SiO 1/2 ) M1 (R 12 R 13 SiO 2/2 ) D1 (R 14 SiO 3/2 ) T1 (SiO 3/2 —Y 1 —SiO 3/2 ) T2 (SiO 4/2 ) Q1   (Chemical Formula 5)

wherein, in Chemical Formula 5,

R 9 to R 14 are each independently selected from a substituted or unsubstituted C1 to C10 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C6 to C20 aryl group, a substituted or unsubstituted C7 to C20 arylalkyl group, a substituted or unsubstituted C1 to C20 heteroalkyl group, a substituted or unsubstituted C2 to C20 heterocycloalkyl group, a substituted or unsubstituted C2 to C20 alkenyl group, a substituted or unsubstituted C2 to C20 alkynyl group, a substituted or unsubstituted C1 to C10 alkoxy group, a substituted or unsubstituted C1 to C30 acyl group, a hydroxy group, a halogen, or a combination thereof, two or more of R 9 to R 14 being hydrogen,

Y 1 is selected from a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, a substituted or unsubstituted C2 to C20 heteroarylene group, a substituted or unsubstituted C2 to C20 alkenylene group, a substituted or unsubstituted C2 to C20 alkenylene group, or a combination thereof,

0<M1<1, 0≦D1<1, 0≦T1<1, 0≦T2<1, 0≦Q1<1, and

M1+D1+T1+T2+Q1=1;

wherein the at least one second siloxane compound includes a compound represented by the following Chemical Formula 6:

(R 15 R 16 R 17 SiO 1/2 ) M2 (R 18 R 19 SiO 2/2 ) D2 (R 20 SiO 3/2 ) T3 (SiO 3/2 —Y 2 —SiO 3/2 ) T4 (SiO 4/2 ) Q2   (Chemical Formula 6)

wherein, in Chemical Formula 6,

R 15 to R 20 are each independently selected from hydrogen, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C7 to C20 arylalkyl group, a substituted or unsubstituted C1 to C20 heteroalkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C2 to C20 heterocycloalkyl group, a substituted or unsubstituted C2 to C20 alkenyl group, a substituted or unsubstituted C2 to C20 alkynyl group, a substituted or unsubstituted C6 to C20 aryl group, a substituted or unsubstituted C1 to C10 alkoxy group, a substituted or unsubstituted C1 to C30 acyl group, a hydroxy group, a halogen, or a combination thereof, two or more of R 15 to R 20 being a substituted or unsubstituted C2 to C20 alkenyl group,

Y 2 is selected from a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, a substituted or unsubstituted C2 to C20 heteroarylene group, a substituted or unsubstituted C2 to C20 alkenylene group, a substituted or unsubstituted C2 to C20 alkenylene group, or a combination thereof,

0<M2<1, 0≦D2<1, 0<T3<1, 0≦T4<1, 0≦Q2<1, and

M2+D2+T3+T4+Q2=1.

2. The curable organo polysiloxane composition as claimed in claim 1 , wherein A is selected from a substituted or unsubstituted C1 to C10 alkylene group, a substituted or unsubstituted C3 to C12 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, or a combination thereof.

3. The curable organo polysiloxane composition as claimed in claim 1 , wherein the at least one compound represented by Chemical Formula 1 includes a compound represented by one of the following Chemical Formula 2 to Chemical Formula 4:

wherein, in Chemical Formulae 2 to 4,

R a to R f are each independently selected from hydrogen, a hydroxy group, a substituted or unsubstituted C1 to C10 alkyl group, a substituted or unsubstituted C2 to C12 alkenyl group, a substituted or unsubstituted C2 to C12 alkynyl group, a substituted or unsubstituted C1 to C10 alkoxy group, a substituted or unsubstituted C6 to C10 aryl group, a halogen, or a combination thereof,

at least one of R a to R c is a substituted or unsubstituted C2 to C12 alkenyl group,

at least one of R d to R f is a substituted or unsubstituted C2 to C12 alkenyl group,

k is an integer of 1 to 3,

o and p are each independently an integer of 1 to 5,

q and r are each independently an integer of 0 to 5, and

s is an integer of 1 to 3.

4. The curable organo polysiloxane composition as claimed in claim 1 , wherein the at least one compound represented by Chemical Formula 1 includes a compound represented by one of the following Chemical Formula 8 to Chemical Formula 11:

5. The curable organo polysiloxane composition as claimed in claim 1 , wherein m is an integer of 0 to 2.

6. The curable organo polysiloxane composition as claimed in claim 1 , wherein n is an integer of 1 to 3.

7. The curable organo polysiloxane composition as claimed in claim 1 , wherein the at least one compound represented by Chemical Formula 1 is included in the composition in an amount of about 0.1 wt % to about 20 wt %, based on a total weight of the composition.

8. The curable organo polysiloxane composition as claimed in claim 1 , wherein at least one of R 9 to R 14 of Chemical Formula 5 is a substituted or unsubstituted C6 to C20 aryl group.

9. The curable organo polysiloxane composition as claimed in claim 1 , wherein the at least one first siloxane compound is included in the composition in an amount of about 10 wt % to about 49 wt %, based on a total weight of the composition.

10. The curable organo polysiloxane composition as claimed in claim 1 , wherein the at least one second siloxane compound further includes a compound represented by the following Chemical Formula 7:

(R 21 R 22 R 23 SiO 1/2 ) M3 (R 24 R 25 SiO 2/2 ) D3 (R 26 SiO 3/2 ) T5 (SiO 3/2 —Y 3 —SiO 3/2 ) T6 (SiO 4/2 ) Q3   (Chemical Formula 7)

wherein, in Chemical Formula 7,

R 21 to R 26 are each independently selected from hydrogen, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C7 to C20 arylalkyl group, a substituted or unsubstituted C1 to C20 heteroalkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C2 to C20 heterocycloalkyl group, a substituted or unsubstituted C2 to C20 alkenyl group, a substituted or unsubstituted C2 to C20 alkynyl group, a substituted or unsubstituted C6 to C20 aryl group, a substituted or unsubstituted C1 to C10 alkoxy group, a substituted or unsubstituted C1 to C30 acyl group, a hydroxy group, a halogen, or a combination thereof,

two or more of R 21 to R 26 are a substituted or unsubstituted C2 to C20 alkenyl group,

Y 3 is selected from a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, a substituted or unsubstituted C2 to C20 heteroarylene group, a substituted or unsubstituted C2 to C20 alkenylene group, a substituted or unsubstituted C2 to C20 alkynylene group, or a combination thereof,

0<M3<1, 0<D3<1, 0≦T5<1, 0≦T6<1, 0≦Q3<1, and

M3+D3+T5+T6+Q3=1.

11. The curable organo polysiloxane composition as claimed in claim 10 , wherein the compound represented by Chemical Formula 7 is included in the composition in an amount of about 0.1 wt % to about 20 wt %, based on a total weight of the composition.

12. The curable organo polysiloxane composition as claimed in claim 1 , wherein the at least one second siloxane compound is included in the composition in an amount of about 50 wt % to about 89 wt %, based on a total weight of the composition.

13. An encapsulant obtained by curing the composition as claimed in claim 1 .

14. An electronic device comprising the encapsulant as claimed in claim 13 .

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Oct 5, 2017
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DNA TECHNOLOGIES, INC.
Reel/Frame 044167/0215 →
SECURITY INTEREST Recorded Feb 1, 2016
From: INTEGRATED DNA TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 037675/0041 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2015
From: YOO, HONG-JUNG; KOH, SANG-RAN; KIM, YOUNG-HO; KIM, WOO-HAN; SHIN, DONG-JU
To: SAMSUNG SDI CO., LTD.
Reel/Frame 036672/0658 →