Densely arrayed waveguides with low cross-coupling
Described herein are lasers comprising an output port to output an optical signal, a plurality of waveguide segments forming an optical cavity length, and a resonant optical cavity comprising the optical cavity length, a gain medium included in the resonant optical cavity to amplify the optical signal, and a heating element disposed near at least two of the plurality of waveguide segments, the heating element controllable to adjust the phase of the optical signal by heating the waveguide segments. Described herein are optical devices comprising a first plurality of ports to output a plurality of optical signals, a second plurality of ports to receive the plurality of optical signals, and a plurality of coupling waveguides. The plurality of waveguide may comprise a pair of adjacent waveguides separated by a first distance, each of the pair of adjacent waveguides comprising a different width.
1. A laser comprising:
a resonant optical cavity comprising a folded waveguide comprising a plurality of interconnected waveguide segments arranged parallel to each other;
a gain medium included in the resonant optical cavity to amplify an optical signal in the resonant optical cavity; and
a heating element disposed near at least two adjacent ones of the plurality of waveguide segments, the heating element controllable to adjust the phase of the optical signal by heating the at least two adjacent waveguide segments, one of the two adjacent waveguide segments having a width different from a width of the other one of the two adjacent waveguide segments.
2. The laser of claim 1 , wherein the plurality of waveguide segments are interconnected by a plurality of waveguide connection segments, and wherein the heating element is disposed to not heat any of the plurality of waveguide connection segments.
3. The laser of claim 1 wherein the plurality of waveguide segments are included in a spiral waveguide.
4. The laser of claim 3 , wherein the spiral waveguide f includes a single hairpin connection waveguide segment, and wherein the heating element is disposed to not heat hairpin segment.
5. The laser of claim 1 , wherein the heating element is controllable to adjust the phase of the optical signal by an interval greater than 2*pi.
6. The laser of claim 1 , wherein the laser is included in a photonic integrated circuit (PIC), and a length of the optical cavity exceeds a length of the PIC.
7. The laser of claim 1 , wherein the folded waveguide comprises curved waveguide segments arranged parallel to each other.
8. The laser of claim 1 , wherein the laser is implemented in a silicon-on-insulator wafer comprising, near the heated waveguide segments, a backside via.
9. The laser of claim 8 , wherein the backside via is filled with a low-thermal-conductivity material.
10. The laser of claim 1 , wherein the waveguide segments are interconnected by waveguide connection segments including total-internal reflection mirrors.
11. The laser of claim 1 , wherein the resonant optical cavity is a linear cavity formed between a front reflector and a back reflector.
12. The laser of claim 1 , wherein the resonant optical cavity is a ring-shaped cavity.