Multiple impedance correlated electron switch fabric

1. A method, comprising:

forming a plurality of correlated electron switch devices of a non-volatile and programmable fabric of an integrated circuit, including:

forming one or more first correlated electron switch devices of a first correlated electron material, the first correlated electron material having a first particular programmable resistance characteristic and a first particular programmable capacitance characteristic, and

forming one or more second correlated electron switch devices, including forming one or more second correlated electron switch devices of a second correlated electron material, wherein one or more properties of the second correlated electron material are varied from the first correlated electron material to yield a second particular programmable resistance characteristic in the one or more second correlated electron switch devices that varies from the first particular programmable resistance characteristic and a second particular programmable capacitance characteristic in the one or more second correlated electron switch devices that varies from the first particular programmable capacitance characteristic, the first and second particular correlated electron materials further having bulk-switching characteristics,

wherein the programmable fabric to comprise a plurality of individually programmable variable impedance paths.

2. The method of claim 1 , wherein the forming the plurality of correlated electron switch devices comprises forming the one or more first correlated electron switch devices and the one or more second correlated electron switch devices within a particular layer of the integrated circuit.

3. The method of claim 2 , wherein the forming the one or more first correlated electron switch devices and the one or more second correlated electron switch devices within the particular layer of the integrated circuit comprises selective epitaxial deposition to deposit the first particular correlated electron material and the second particular correlated electron material.

4. The method of claim 2 , wherein the forming the one or more first correlated electron switch devices and the one or more second correlated electron switch devices within the particular layer of the integrated circuit fabric comprises adjusting impedance characteristics for one or more of the one or more first correlated electron switch devices and the one or more second correlated electron switch devices via ion implantation.

5. The method of claim 1 , wherein the forming the plurality of correlated electron switch devices comprises forming the one or more first correlated electron switch devices and the one or more second correlated electron switch devices within different layers of the integrated circuit.

6. The method of claim 5 , wherein the forming the one or more first correlated electron switch devices and the one or more second correlated electron switch devices within the different layers of the integrated circuit includes blanket deposition to deposit one or more of the first particular correlated electron material and the second particular correlated electron material.

7. The method of claim 5 , wherein the forming the one or more first correlated electron switch devices and the one or more second correlated electron switch devices within the different layers of the integrated circuit fabric includes selective epitaxial deposition to deposit one or more of the first particular correlated electron material and the second particular correlated electron material.

8. The method of claim 1 , wherein the forming the plurality of correlated electron switch devices comprises blanket deposition of correlated electron material for two or more additional correlated electron switch devices within a particular layer of the programmable fabric.

9. The method of claim 1 , wherein the forming the plurality of correlated electron switch devices comprises forming the one or more first correlated electron switch devices via selective epitaxial deposition and forming the one or more second correlated electron switch devices via blanket deposition.

10. The method of claim 1 , further comprising positioning one or more access devices substantially adjacent to one or more correlated electron switch devices of the plurality of correlated electron switch devices.

11. An apparatus, comprising: a non-volatile programmable fabric of an integrated circuit to include:

one or more first correlated electron switch devices of a first correlated electron material, wherein the first correlated electron material to have a first particular programmable resistance characteristic and a first particular programmable capacitance characteristic; and

one or more second correlated electron switch devices of a second correlated electron material, wherein one or more properties of the second electron material to be varied from the first correlated electron material to yield a second particular programmable resistance characteristic in the one or more second correlated electron switch devices that varies from the first particular programmable resistance characteristic and a second particular programmable capacitance characteristic, in the one or more second correlated electron switch devices that varies from the first particular programmable capacitance characteristic, the first and second particular correlated electron materials further to have bulk-switching characteristics,

wherein the programmable fabric to comprise a plurality of individually programmable variable impedance paths.

12. The apparatus of claim 11 , wherein the one or more first correlated electron switch devices and the one or more second correlated electron switch devices to be positioned within a particular layer of the programmable fabric.

13. The apparatus of claim 12 , wherein one or more of the first particular correlated electron material and the second particular correlated electron material to be deposited by selective epitaxial deposition.

14. The apparatus of claim 11 , wherein the one or more first correlated electron switch devices and the one or more second correlated electron switch devices to be positioned within different layers of the programmable fabric.

15. The apparatus of claim 14 , wherein one or more of the first particular correlated electron material and the second particular correlated electron material to be deposited by blanket deposition.

16. The apparatus of claim 11 , wherein the plurality of individually programmable variable impedance paths to comprise a plurality of individually programmable variable impedance paths between two or more layers of the programmable fabric.

17. The apparatus of claim 16 , wherein one or more of the plurality of correlated electron switch devices to be individually positioned at one or more intersections of electrically conductive lines of a first metallization layer and electrically conductive lines of a second metallization layer of the integrated circuit.

18. The apparatus of claim 17 , further comprising one or more access devices to be positioned at one or more of the intersections of the electrically conductive lines of the first metallization layer and the electrically conductive lines of the second metallization layer.

19. An apparatus, comprising:

a non-volatile programmable fabric to include a plurality of correlated electron switch devices to be positioned in one or more layers of the programmable fabric,

wherein one or more first correlated electron switch devices to comprise a first correlated electron material, wherein the first correlated electron material to include a first particular programmable resistance characteristic and a first particular programmable capacitance characteristic, and

wherein one or more second correlated electron switch devices to comprise a second correlated electron material, wherein the second correlated electron material to have one or more properties that are varied from the first correlated electron material to yield a programmable resistance characteristic in the one or more second correlated electron switch devices that varies from a programmable resistance characteristic of the first correlated electron material and a programmable capacitance characteristic in the one or more second correlated electron switch devices that varies from a programmable capacitance characteristic of the first correlated electron material, the first and second particular correlated electron materials further to have bulk-switching characteristics,

wherein the programmable fabric to comprise a plurality of individually programmable variable impedance paths.

20. The apparatus of claim 19 , further comprising one or more access devices to be positioned substantially adjacent to one or more of the plurality of correlated electron switch devices within the programmable fabric.