Method for preparing a wire to receive a contact element
View Patent ↗A method is provided for preparing a wire for installation of a terminal. The method comprises removing an insulating layer from a conductor to expose a portion of a conductor. The method further includes attaching a conductive foil layer to a portion of the exposed portion of the conductor by applying pressure to the conductive foil layer.
1. A method for preparing a wire to accept a contact element, the wire comprising a conductor and an insulating layer surrounding the conductor, the conductor being formed of a first material, the method comprising:
removing a portion of the insulating layer from the conductor to expose a portion of the conductor, the exposed portion of the conductor having a first length; and
joining a conductive foil layer and at least a portion of the exposed portion of the conductor together, the conductive foil layer having a second length, wherein:
the conductive foil layer is formed of a second material;
the first length is greater than the second length; and
the conductor is elongated and has a substantially round cross-sectional profile.
2. The method of claim 1 wherein the joining comprises ultrasonically welding the conductive foil layer to the exposed portion of the conductor.
3. The method of claim 1 further comprising, following the joining, dipping at least a portion of the exposed portion of the conductor and the conductive foil layer into molten solder.
4. The method of claim 1 wherein the first material comprises aluminum and the second material comprises copper.
5. The method of claim 1 wherein the conductor has a diameter, the conductive foil layer has a thickness, and the ratio of the diameter of the conductor to the thickness of the conductive foil layer is about 200:1.
6. The method of claim 1 wherein the first material is different from the second material.
7. The method of claim 1 wherein the conductive foil layer comprises one or more of a corrugated screen, a film, a sheet, and a ferrule.
8. The method of claim 1 further comprising cleaning the exposed portion of the conductor, prior to the joining.
9. The method of claim 8 wherein the cleaning comprises plasma treating the exposed portion of the conductor.
10. The method of claim 1 further comprising circumferentially surrounding at least a portion of the exposed portion of the conductor with the conductive foil layer, prior to the joining.