Strategic placement of plastic structures for EMI management of transceiver module

1. An optoelectronic module comprising:

a housing that extends along a longitudinal axis between a first end portion and a second end portion, the first end portion configured to interface with at least one fiber optic cable including one or more optical fibers;

a printed circuit board (“PCB”) within the housing that includes an electrical connector at the second end portion of the housing;

at least one transmitter positioned inside of the housing, the transmitter electrically coupled to the PCB and optically coupled with at least one of the one or more optical fibers;

at least one receiver positioned inside of the housing, the receiver electrically coupled to the PCB and optically coupled with at least another one of the one or more optical fibers;

at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI, wherein the at least one EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module and wherein the EMI attenuating component is selected from a group consisting of:

a PCB spacer, wherein the PCB spacer is positioned between the PCB and a second PCB in a double-deck PCB arrangement;

a three-dimensional EMI absorber including a first portion defining a first plane extending transverse to the longitudinal axis of the housing and positioned between the PCB and one or both of a transmitter optical subassembly (“TOSA”) and a receiver optical subassembly (“ROSA”), and a second portion defining a second plane extending transverse to the first plane and parallel to the longitudinal axis of the housing, wherein the second portion is positioned between the housing and the TOSA or the ROSA.

2. The optoelectronic module of claim 1 , wherein the plastic material comprises a plastic filled with one or more of: nickel coated carbon fiber, stainless steel filler, and electrically conductive filler.

3. The optoelectronic module of claim 1 , wherein the at least one EMI attenuating component is injection molded.

4. The optoelectronic module of claim 1 , wherein the at least one EMI attenuating component includes the PCB spacer and wherein the PCB spacer is configured to support the PCB and the second PCB inside of the housing.

5. A method comprising:

forcing a molten plastic material that includes nickel-coated carbon fiber or electrically conductive filler into a mold cavity of a mold;

solidifying the molten plastic material that includes the nickel-coated carbon fiber or electrically conductive filler into a shape that conforms to a contour of the mold to form a component of an optoelectronic module from the plastic material that includes the nickel-coated carbon fiber or electrically conductive filler, wherein the component comprises an electromagnetic interference (“EMI”) attenuating component selected from a group consisting of:

a PCB spacer, wherein the PCB spacer is positioned between the PCB and a second PCB in a double-deck PCB arrangement;

a three-dimensional EMI absorber including a first portion defining a first plane extending transverse to the longitudinal axis of the housing and positioned between the PCB and one or both of a transmitter optical subassembly (“TOSA”) and a receiver optical subassembly (“ROSA”), and a second portion defining a second plane extending transverse to the first plane and parallel to the longitudinal axis of the housing, wherein the second portion is positioned between the housing and the TOSA or the ROSA.

6. The method of claim 5 , wherein the EMI attenuating component is injection molded.

7. The method of claim 5 , wherein the EMI attenuating component includes the PCB spacer and wherein the PCB spacer is configured to support the PCB and the second PCB inside of the housing.

8. The method of claim 5 , wherein the EMI attenuating component includes the fiber tray, the one or more internal optical cables is coupled to a transmitter optical subassembly (“TOSA”) and a receiver optical subassembly (“ROSA”), and the fiber tray supports the TOSA and the ROSA.

9. The method of claim 5 , wherein the EMI attenuating component includes the port retention bar that is disposed against the housing to retain the TOSA and the ROSA with respect to one another.

10. An optoelectronic module comprising:

a housing that extends along a longitudinal axis between a first end portion and a second end portion, the first end portion configured to interface with at least one fiber optic cable including one or more optical fibers;

a printed circuit board (“PCB”) within the housing that includes an electrical connector at the second end portion of the housing;

at least one transmitter positioned inside of the housing, the transmitter electrically coupled to the PCB and optically coupled with at least one of the one or more optical fibers;

at least one receiver positioned inside of the housing, the receiver electrically coupled to the PCB and optically coupled with at least another one of the one or more optical fibers;

at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI, wherein the at least one EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module, the EMI attenuating comprising:

a fiber tray supporting one or more internal optical cables positioned inside of the housing.