Encapsulated micro-electromechanical system switch and method of manufacturing the same

1. A method for manufacturing a micro-electromechanical system (MEMS) switch, comprising:

providing a substrate;

providing an actuator plate and a contact pad over the substrate;

providing a first sacrificial layer over the actuator plate and the contact pad;

forming a patterned barrier layer over the first sacrificial layer, wherein a first area of the first sacrificial layer is exposed through the patterned barrier layer and aligned over the contact pad;

forming an actuation member over the patterned barrier layer;

providing a second sacrificial layer over the actuation member;

providing a first encapsulation layer over the second sacrificial layer, wherein the first encapsulation layer encloses the actuation member, the actuator plate, and the contact pad; and

removing the first sacrificial layer and the second sacrificial layer.

2. The method of claim 1 wherein:

the first sacrificial layer comprises a non-polymer based sacrificial layer; and

the second sacrificial layer comprises a polymer based sacrificial layer.

3. The method of claim 2 wherein the non-polymer based sacrificial layer is formed from a metal.

4. The method of claim 3 wherein the metal is copper (Cu).

5. The method of claim 3 wherein the polymer based sacrificial layer consists of a polymethylglutarimide layer.

6. The method of claim 1 further comprising providing an anchor pad over the substrate, wherein providing the first sacrificial layer over the actuator plate and the contact pad further comprises:

providing the first sacrificial layer over the anchor pad; and

removing a section of the first sacrificial layer to expose an area of the anchor pad.

7. The method of claim 6 wherein the actuation member extends along a side surface of the first sacrificial layer toward the exposed area of the anchor pad.

8. The method of claim 1 further comprising forming a hard conductive layer that extends through the patterned barrier layer and is in contact with the first area of the first sacrificial layer, wherein the hard conductive layer is electrically coupled to the actuation member.

9. The method of claim 8 , wherein a recess is formed at the first area of the first sacrificial layer and the hard conductive layer extends into the recess.

10. The method of claim 1 , wherein the actuation member comprises an arm and a contact portion, wherein:

the arm is over the actuator plate; and

the contact portion protrudes from the arm and toward the first area of the first sacrificial layer.

11. The method of claim 10 further comprising forming a hard conductive layer that extends through the patterned barrier layer, is aligned underneath the contact portion, and is in contact with the first area of the first sacrificial layer, wherein the hard conductive layer is electrically coupled to the actuation member.

12. The method of claim 1 wherein the first sacrificial layer and the second sacrificial layer are formed from different sacrificial materials.

13. A fabrication device for manufacturing an encapsulated micro-electromechanical system (MEMS) switch, comprising:

a substrate;

an actuator plate over the substrate;

a contact pad over the substrate;

a first sacrificial layer over the actuator plate and the contact pad;

a patterned barrier layer over the first sacrificial layer, wherein a first area of the first sacrificial layer is exposed through the patterned barrier layer and aligned over the contact pad;

an actuation member over the patterned barrier layer;

a second sacrificial layer over the actuation member; and

a first encapsulation layer over the second sacrificial layer, wherein the first encapsulation layer encloses the actuation member, the actuator plate, and the contact pad.

14. The fabrication device of claim 13 wherein:

the first sacrificial layer comprises a non-polymer based sacrificial layer; and

the second sacrificial layer comprises a polymer based sacrificial layer.

15. The fabrication device of claim 14 wherein the non-polymer based sacrificial layer is formed from a metal.

16. The fabrication device of claim 15 wherein the metal that forms the non-polymer based sacrificial layer is copper (Cu).

17. The fabrication device of claim 15 wherein the polymer based sacrificial layer consists of a polymethylglutarimide layer.

18. The fabrication device of claim 13 further comprising a hard conductive layer that extends through the patterned barrier layer and is in contact with the first area of the first sacrificial layer, wherein the hard conductive layer is electrically coupled to the actuation member.

19. The fabrication device of claim 18 , wherein a recess is formed at the first area of the first sacrificial layer and the hard conductive layer extends into the recess.

20. The fabrication device of claim 13 , wherein the actuation member comprises an arm and a contact portion, wherein:

the arm is over the actuator plate; and

the contact portion protrudes from the arm and toward the first area of the first sacrificial layer.

21. The fabrication device of claim 20 further comprising a hard conductive layer that extends through the patterned barrier layer, is aligned underneath the contact portion, and is in contact with the first area of the first sacrificial layer, wherein the hard conductive layer is electrically coupled to the actuation member.

22. The fabrication device of claim 13 wherein the first sacrificial layer and the second sacrificial layer are formed from different sacrificial materials.