IP Library Granted Patent US 9,484,497
Granted Patent B2
US 9,484,497 · App. 14/880,242 · Granted Nov 1, 2016

Surface treatment of a semiconductor light emitting device

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Quick Facts
Patent No.
US 9,484,497
App. No.
14/880,242
Granted
Nov 1, 2016
Kind
B2
Abstract

A semiconductor light-emitting device includes a semiconductor structure having a light-emitting region. A surface of the semiconductor structure has flattened peaks.

Claims (23)

1. A semiconductor light-emitting device, comprising:

a semiconductor structure comprising a light-emitting region, wherein the semiconductor structure comprises:

an n-type region;

a p-type region;

the light-emitting region between the n- and the p-type regions;

an n-contact disposed on the n-type region; and

a p-contact disposed on the p-type region, wherein the n-contact is insulated by a gap from the active region, the p-type region, and the p-contact,

wherein a surface of the semiconductor structure comprises flattened peaks.

2. The device of claim 1 , wherein each flattened peak comprises a flat top.

3. The device of claim 1 , further comprising a wavelength converting material over the surface.

4. The device of claim 1 , further comprising a mount, wherein the semiconductor structure is attached to the mount.

5. The device of claim 1 , wherein the surface comprises a surface of the n-type region.

6. The device of claim 1 , wherein the gap is filled with an insulating material.

7. The device of claim 1 , wherein the flattened peaks are formed by etching the surface and then treating the surface with plasma.

8. A light-emitting device, comprising:

a semiconductor structure, comprising:

an n-type region, wherein a surface of the n-type region comprises flattened peaks;

a p-type region;

a light-emitting region between the n- and the p-type regions;

an n-contact to the n-type region; and

a p-contact to the p-type region wherein the n-contact is insulated by a gap from the active region, the p-type region, and the p-contact;

a wavelength converting material over the surface of the n-type region; and

a mount supporting the semiconductor region.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2018
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 046635/0071 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2018
From: RONG, YIWEN; GORDON NEFF, JAMES; SENG THANG, TAK
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 045530/0358 →
SECURITY INTEREST Recorded Jul 7, 2017
From: LUMILEDS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 043108/0001 →