IMAGE PICKUP APPARATUS AND ELECTRONIC ENDOSCOPE
An image pickup apparatus includes a laminated substrate on which a plurality of electronic components configuring a driving circuit of a solid-state image pickup device are mounted and in which a plurality of conductor layers and a plurality of vias are formed, electronic component connection lands provided on a surface of the laminated substrate, any one of the plurality of electronic components being electrically connected to the electronic component connection lands, and a cable connection land provided on the surface of the laminated substrate, a plurality of signal cables being electrically connected to the cable connection land. At least one of the plurality of electronic components is embedded in a position superimposed on the electronic component connection lands or the cable connection land on an inside of the laminated substrate.
1 . An image pickup apparatus comprising:
a solid-state image pickup device including a light-receiving element section that detects a subject image;
a laminated substrate on which a plurality of electronic components configuring a driving circuit of the solid-state image pickup device are mounted and in which a plurality of conductor layers and a plurality of vias are formed;
an electronic component connection land provided on a surface of the laminated substrate, any one of the plurality of electronic components being electrically connected to the electronic component connection land; and
a cable connection land provided on the surface of the laminated substrate, a plurality of signal cables being electrically connected to the cable connection land, wherein
at least one of the plurality of electronic components is embedded in a position superimposed on the electronic component connection land or the cable connection land on an inside of the laminated substrate.
2 . The image pickup apparatus according to claim 1 , wherein the laminated substrate, the plurality of electronic components, and the plurality of signal cables are disposed to be fit within a projection plane of the solid-state image pickup device with respect to a direction along a photographing optical axis of the subject image.
3 . The image pickup apparatus according to claim 1 , wherein the conductor layer of the laminated substrate is stacked and formed to extend in a direction orthogonal to a plane on which a light-receiving element section of the solid-state image pickup device is formed.
4 . The image pickup apparatus according to claim 1 , wherein at least one of the electronic components and at least one of the vias embedded in the laminated substrate are provided adjacent to each other and provided in parallel along a longitudinal direction of the stacked substrate.
5 . The image pickup apparatus according to claim 1 , further comprising,
a step formed on the laminated substrate and provided with the cable connection land, wherein
among the plurality of signal cables, an image cable for transmitting an image signal and a synchronization signal cable for transmitting a synchronization signal are connected to different surfaces of the circuit board section separated by the step.
6 . The image pickup apparatus according to claim 5 , wherein
in the laminated substrate, a rigid substrate is stacked and connected to be formed on a flexible printed board and the step separated in a height direction is formed by a surface of the flexible printed board and a surface of the rigid substrate, and
the image cable and the synchronization signal cable are connected in positions separated from each other in the height direction of the laminated substrate.
7 . The image pickup apparatus according to claim 5 , wherein the image cable and the synchronization signal cable are connected in positions separated from each other in a longitudinal direction along a photographing optical axis of the subject image of the laminated substrate.
8 . The image pickup apparatus according to claim 5 , wherein the image cable and the synchronization signal cable are connected in positions separated in a width direction of the laminated substrate.
9 . The image pickup apparatus according to claim 5 , wherein the image cable and the synchronization signal cable are connected in positions separated in a diagonal direction in a cross section orthogonal to a longitudinal direction along the photographing optical axis of the subject image of the laminated substrate.
10 . The image pickup apparatus according to claim 5 , wherein the rigid substrate, the electronic component, and the plurality of signal cables are fit within a projection area of the solid-state image pickup device along the photographing optical axis of the subject image.
11 . The image pickup apparatus according to claim 6 , wherein, among the plurality of signal cables, the power supply cable and/or the ground cable is connected to a lower stage side in the height direction of the step.
12 . The image pickup apparatus according to claim 5 , wherein the step is within a range of 0.2 mm to 4.0 mm.
13 . An electronic endoscope comprising the image pickup apparatus according to claim 1 provided at a distal end portion of an insertion section.