Communication module alignment

1. An apparatus comprising:

a first communication module of a first device including:

a printed circuit board,

one or more integrated circuit packages mounted on the printed circuit board, wherein each of the one or more integrated circuit packages comprise a wireless transceiver, transmitter, or receiver, and

one or more magnets positioned relative to the one or more integrated circuit packages,

wherein the one or more magnets are configured to move within the first device such that, when in an engaged position, the one or more magnets attractively couple the first communication module to a second communication module of a second device positioned in proximity to the first communication module.

2. The apparatus of claim 1 , wherein the first communication module further comprises a respective signal guiding structure surrounding a perimeter formed by each of the one or more integrated circuit packages, wherein each signal guiding structure is configured to insulate the respective integrated circuit package from extraneous signals and to form a channel providing a pathway for data communications.

3. The apparatus of claim 2 , wherein the one or more magnets include one or more magnets surrounding a portion of each signal guiding structure.

4. The apparatus of claim 2 , wherein the one or more magnets includes a center magnet positioned between a first signal guiding structure and a second signal guiding structure.

5. The apparatus of claim 1 , wherein the one or more integrated circuit packages comprises a transmitter integrated circuit package and a receiver integrated circuit package.

6. The apparatus of claim 5 , wherein the one or more magnets comprise one or more magnets surrounding at least a portion of the transmitter integrated circuit package and one or more magnets surrounding at least a portion of the receiver integrated circuit package.

7. The apparatus of claim 5 , wherein the one or more magnets further comprise a central magnet positioned between the transmitter integrated circuit package and the receiver integrated circuit package.

8. The apparatus of claim 1 , wherein the first communication module is configured to move within the first device between an engaged position and a disengaged position.

9. The apparatus of claim 8 , wherein moving the first communication module between the engaged position and the disengaged position comprises moving the printed circuit board.

10. The apparatus of claim 9 , wherein the printed circuit board is biased to the disengaged position when the one or more magnets are not attracted to magnets of the second communication module.

11. The apparatus of claim 1 , wherein at least one of the magnets is biased to a disengaged position when the one or more magnets are not attracted to magnets of the second communication module.

12. The apparatus of claim 8 , wherein the first communication module moves to the engaged position in response to the second communication module being positioned in proximity to the first communication module.

13. The apparatus of claim 12 , wherein the magnets in the engaged position align at least one of the one or more integrated circuit packages with an integrated circuit package of the second communication module.

14. An apparatus comprising:

a first device comprising:

a movable communication module including:

a printed circuit board,

one or more integrated circuit packages mounted on the printed circuit board, wherein each of the one or more integrated circuit packages comprise a wireless transceiver, transmitter, or receiver, and

one or more magnets positioned relative to the one or more integrated circuit packages,

wherein the movable communication module is configured to move within the first device between an engaged position and a disengaged position, wherein the movable communication module is in an engaged position when coupled to a second device and in a disengaged position when not coupled to the second device.