Method for producing an optoelectronic device with a contact area of accurately and reproducibily defined size
A method for producing an optoelectronic component is disclosed. A first layer which has a dielectric to the surface of a semiconductor crystal. A photoresist layer is applied and structured on the first layer. The photoresist layer is structured in such a way that the photoresist layer has an opening, The first layer is partially separated in order to expose a lateral region of the surface. A contact area having a first metal is applied in the lateral region of the surface. The photoresist layer is removed. A second layer, which comprises an optically transparent, electrically conductive material, and a third layer, which comprises a second metal, are applied.
1. A method for producing an optoelectronic device, the method comprising:
providing a semiconductor crystal that has a surface, the semiconductor crystal being provided for producing the optoelectronic device;
applying a first layer that comprises a dielectric onto the surface, the dielectric serving as a mirror dielectric;
applying and patterning a photoresist layer on the first layer, wherein the photoresist layer is patterned in such a manner that it comprises an opening for partially dissolving away the first layer;
partially dissolving away the first layer in order to uncover a lateral region of the surface;
applying a contact area that comprises a first metal in the lateral region of the surface, the contact area serving for electrically contacting the semiconductor crystal;
removing the photoresist layer;
applying a second layer that comprises an optically transparent, electrically conductive material which is a transparent, electrically conductive oxide; and
applying a third layer that comprises a second metal and serves as a mirror layer.
2. The method according to claim 1 , wherein the photoresist layer comprises a positive resist.
3. The method according to claim 1 , wherein the first layer is partially dissolved away by wet chemical etching.
4. The method according to claim 3 , wherein the photoresist layer is partially underetched while the first layer is being dissolved away.
5. The method according to claim 1 , wherein a size of the contact area highly accurately matches a size of the opening in the photoresist layer.
6. The method according to claim 1 , wherein the uncovered lateral region of the surface of the semiconductor crystal has a diameter, the diameter being larger than an opening diameter of the opening in the photoresist layer.
7. The method according to claim 1 , wherein a diameter of the opening in the first layer is larger than an opening diameter of the opening in the photoresist layer.
8. The method according to claim 1 , wherein the photoresist layer is partially underetched while the first layer is being dissolved away, and wherein an underetch is formed under the photoresist layer.
9. A method for producing an optoelectronic device, the method comprising:
providing a semiconductor crystal that has a surface, the semiconductor crystal being provided for producing the optoelectronic device;
applying a first layer that comprises a dielectric onto the surface, the dielectric serving as a mirror dielectric;
applying and patterning a photoresist layer on the first layer, wherein the photoresist layer is patterned in such a manner that it comprises an opening;
partially dissolving away the first layer in order to uncover a lateral region of the surface;
applying a contact area that comprises a first metal in the lateral region of the surface, wherein a size of the contact area highly accurately matches a size of the opening in the photoresist layer, and wherein the contact area serves for electrically contacting the semiconductor crystal;
removing the photoresist layer;
applying a second layer that comprises an optically transparent, electrically conductive material which is a transparent, electrically conductive oxide; and
applying a third layer that comprises a second metal and serves as a mirror layer.
10. A method for producing an optoelectronic device, the method comprising:
providing a semiconductor crystal that has a surface, the semiconductor crystal being provided for producing the optoelectronic device;
applying a first layer that comprises a dielectric onto the surface, the dielectric serving as a mirror dielectric;
applying and patterning a photoresist layer on the first layer, wherein the photoresist layer is patterned in such a manner that it comprises an opening;
partially dissolving away the first layer in order to uncover a lateral region of the surface, wherein the photoresist layer is partially underetched while the first layer is being dissolved away, and wherein an underetch is formed under the photoresist layer;
applying a contact area that comprises a first metal in the lateral region of the surface, the contact area serving for electrically contacting the semiconductor crystal;
removing the photoresist layer;
applying a second layer that comprises an optically transparent, electrically conductive material which is a transparent, electrically conductive oxide; and
applying a third layer that comprises a second metal and serves as mirror layer.