Process for producing an optoelectronic component and optoelectronic component
View Patent ↗Various embodiments may relate to a process for producing an optoelectronic component. In the process, a carrier is provided. A first electrode is formed upon the carrier. An optically functional layer structure is formed upon the first electrode. A second electrode is formed upon the optically functional layer structure. At least one of the two electrodes is formed by disposing electrically conductive nanowires on a surface on which the corresponding electrode is to be formed, and by heating the nanowires in such a way that they plastically deform.
1. A process for producing an optoelectronic component, the method comprising:
providing a carrier,
forming a first electrode upon the carrier,
forming an optically functional layer structure upon the first electrode, and
forming a second electrode upon the optically functional layer structure,
wherein the forming of at least one of the first and second electrodes involves disposing electrically conductive nanowires on a surface on which the first or second electrode is to be formed, and heating the nanowires in such a way that the nanowires plastically deform, and wherein the deformed nanowires subsequently form at least part of the first or second electrode.
2. The process as claimed in claim 1 , wherein the nanowires when disposed on the surface form a three-dimensional network and wherein the nanowires are heated in such a way that the material of the nanowires becomes amenable to simple plastic deformation and the nanowires flatten on the surface because of their mass and hence form a two-dimensional network.
3. The process as claimed in claim 2 , wherein the nanowires are disposed on the corresponding electrode, the nanowires are heated and the optoelectronic component is disposed in a centrifuge and is rotated by the centrifuge in such a way that the nanowires flatten on the surface because of the action of the centrifugal force.
4. The process as claimed in claim 1 , wherein a degree of networking of the nanowires increases as a result of the heating and the associated deforming.
5. The process as claimed in claim 1 , wherein the nanowires are heated in such a way that the nanowires become cohesively bonded to one another.
6. The process as claimed in claim 1 , wherein the nanowires are heated in such a way that the material of the nanowires does not melt completely, such that a wire-like structure of the individual nanowires and a network-like structure of the nanowires overall is preserved.
7. The process as claimed in claim 1 , wherein the nanowires are embedded in a carrier material and wherein the carrier material together with the nanowires is applied to the surface.
8. The process as claimed in claim 1 , wherein the first electrode is formed by the nanowires and in which the nanowires are disposed upon the carrier.
9. The process as claimed in claim 1 , wherein the second electrode is formed by the nanowires and wherein the nanowires are disposed upon the optically functional layer structure.