Interconnect device and module using same
Various embodiments of an interconnect device and modules and systems that utilize such interconnect device are disclosed. In one or more embodiments, the interconnect device can include a printed circuit board (PCB). The PCB can include a substrate forming a resiliently deflectable element, a conductive material disposed on the substrate, and an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material. The interconnect device can also include a connector that includes a connecting pin configured to electrically couple with the electrical contact of the resiliently deflectable element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.
1. An interconnect device, comprising:
a printed circuit board (PCB) comprising:
a substrate forming a resiliently deflectable element, wherein the resiliently deflectable element comprises a peripheral portion of the substrate that comprises a slot formed in the substrate that defines the resiliently deflectable element;
a conductive material disposed on the substrate; and
an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material; and
a connector comprising a connecting pin configured to electrically couple with the electrical contact of the resiliently deflectable element of the PCB and cause the resiliently deflectable element to deflect when the resiliently deflectable element contacts the connecting pin.
2. The device of claim 1 , wherein the connector further comprises a body having an opening configured to receive the connecting pin.
3. The device of claim 2 , wherein the connecting pin is fixed.
4. The device of claim 2 , wherein the connector further comprises a gasket positioned around a periphery of the body.
5. The device of claim 1 , wherein the PCB further comprises an insulating layer disposed such that the conductive material is between the insulating layer and the substrate.
6. The device of claim 5 , wherein the electrical contact comprises a via formed through the insulating layer to the conductive material.
7. The device of claim 1 , wherein the conductive material and the electrical contact are disposed on a first major surface of the substrate of the PCB.
8. The device of claim 1 , wherein the conductive material is disposed on a second major surface of the PCB, and the electrical contact is disposed on a first major surface of the substrate, wherein the electrical contact is electrically coupled to the conductive material through one or more vias that extend through the substrate.
9. The device of claim 1 , further comprising an electronic component disposed on a first major surface of the PCB and electrically coupled to the conductive material.
10. The device of claim 9 , wherein the electronic component comprises a sensor.
11. The device of claim 10 , wherein the electronic component comprises a resonator.
12. The device of claim 11 , wherein the resonator comprises a bulk acoustic wave resonator.
13. The device of claim 12 , wherein the bulk acoustic resonator comprises a shear-mode bulk acoustic wave resonator.
14. The device of claim 11 , wherein the device comprises a second resonator and a switch that operatively couples the resonator and the second resonator to the conductive material.
15. A resonator sensor module comprising a module interface and a resonator electrically coupled to the module interface, wherein the module interface comprises a printed circuit board (PCB) comprising:
a substrate forming a resiliently deflectable element, wherein the resiliently deflectable element comprises a peripheral portion of the substrate that comprises a slot formed in the substrate that defines the resiliently deflectable element;
a conductive material disposed on the substrate; and
an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material;
wherein the resonator is electrically coupled to the conductive material.
16. The module of claim 15 , wherein the resonator comprises a bulk acoustic wave resonator.
17. The module of claim 15 , wherein the resonator comprises a sensing resonator comprising binding sites for an analyte material and a reference resonator that lacks binding sites for the analyte material.
18. The module of claim 17 , wherein the module further comprises a switch comprising a first position that operatively couples the sensing resonator and the module interface and a second position that operatively couples the reference resonator and the module interface.
19. A resonator sensor system for measuring binding kinetics of an interaction of an analyte material present in a fluid sample, comprising:
the resonator sensor module of claim 15 ; and
a measurement apparatus operatively coupled to the resonator sensor module through an interconnect device comprising the module interface of the resonator sensor module and a connector of the measurement apparatus, wherein the measurement apparatus comprises:
actuation circuitry configured to drive the resonator into an oscillating motion;
measurement circuitry configured to measure a resonator output signal representing a resonance characteristic of the oscillating motion of the resonator; and
a controller operatively coupled to the actuation and measurement circuitry.
20. The system of claim 19 , wherein the connector electrically couples the measurement apparatus to the module interface of the resonator sensor module, the connector comprising a connecting pin configured to electrically couple with the electrical contact of the resiliently deflectable element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.