IP Library Granted Patent US 11,166,396
Granted Patent B2
US 11,166,396 · App. 14/893,774 · Granted Nov 2, 2021

Box-type vehicle-mounted control device

Inventors: Maki Ito (Tokyo, JP); Toshiaki Ishii (Tokyo, JP); Masaru Kamoshida (Ibaraki, JP); Hideto Yoshinari (Ibaraki, JP); Masato Saito (Ibaraki, JP); Akitoyo Konno (Tokyo, JP)
Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
H05K7/20854H05K1/0206H05K1/0209H05K1/18H05K7/20409H01R12/724H05K2201/066H05K2201/10189
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Quick Facts
Patent No.
US 11,166,396
App. No.
14/893,774
Granted
Nov 2, 2021
Kind
B2
Abstract

Provided is a box-type vehicle-mounted control device that effectively increases the amount of heat transfer from electronic components and a circuit board to a casing (base and cover) and that accordingly has achieved excellent heat dissipation property. The box-type vehicle-mounted control device includes a circuit board 12 , a base 13 , and a cover 14 . In addition, a first heat radiating coating layer 31 is formed on at least one surface of the circuit board 12 , and a second heat radiating coating layer 32 is formed on an inner surface of one or both of the base 13 and the cover 14 facing the first heat radiating coating layer 31.

Claims (46)

1. A vehicle-mounted control device comprising:

a circuit board on which an electronic component is mounted;

a casing configured to contain the circuit board, wherein the casing comprises:

a base to which the circuit board is fixed, and

a cover assembled to the base so as to cover the circuit board;

a connection terminal coupled to a first surface of the circuit board, the connection terminal configured to electrically connect the circuit board with an outside of the casing;

a connector housing configured to contain at least a portion of the connection terminal;

a first heat radiating coating layer disposed on a surface layer of the connection terminal between the circuit board and the connector housing,

wherein a film thickness of the first heat radiating coating layer is between 1 micrometers (μm) and 200 micrometers (μm), and the first heat radiating coating layer is not in contact with the casing;

a second heat radiating coating layer disposed on the first surface of the circuit board that is opposite a second surface of the circuit board facing the base, wherein the first surface is the only surface of the circuit board on which the second heat radiating coating layer is disposed; and

a third heat radiating coating layer disposed on an inner surface of the cover facing the second heat radiating coating layer,

wherein each of the first, second, and third heat radiating coating layers is made of a composite material including organic resin to which inorganic particles have been blended,

wherein a thermal via is provided in the circuit board at a portion on which the electronic component is mounted,

wherein the base comprises a rectangular protrusion extending towards the circuit board from a flat portion of the base, and

wherein the vehicle-mounted control device further comprises a high-thermal conductivity layer extending from the second surface of the circuit board to the rectangular protrusion and contacting the second surface of the circuit board, the thermal via, and the rectangular protrusion, the high-thermal conductivity layer comprising one of adhesive, grease, or a heat dissipation sheet.

2. The vehicle-mounted control device according to claim 1 ,

wherein the casing comprises:

a fourth heat radiating coating layer disposed on an outer surface of the cover.

3. The vehicle-mounted control device according to claim 1 ,

wherein the connection terminal comprises a plurality of pin terminals, and the connector housing defines one or more through holes through which the pin terminals are inserted, and the first heat radiating coating layer is disposed on one or more of the pin terminals so as to cover a part or all of a portion of the one or more pin terminals ranging from a circuit board-side couple-bonding portion to the connector housing.

4. The vehicle-mounted control device according to claim 3 ,

wherein the first heat radiating coating layer is formed so as to seal a gap portion formed between each of the pin terminals and each of the through holes, respectively.

5. The vehicle-mounted control device according to claim 2 ,

wherein infrared absorption regions of at least two of the first, second, third, and fourth heat radiating coating layers formed in the device overlap with each other.

6. The vehicle-mounted control device according to claim 1 ,

wherein the second heat radiating coating layer is further formed at a gap portion formed between the circuit board and the electronic component mounted on the circuit board in a state of being spaced from the circuit board.

7. The vehicle-mounted control device according to claim 1 ,

wherein a heat dissipation fin is provided on an outer surface of the cover on which the third heat radiating coating layer is formed.

8. The vehicle-mounted control device according to claim 1 ,

wherein a surface condition of each of the heat radiating coating layers is roughened.

9. The vehicle-mounted control device according to claim 1 ,

wherein the inorganic particles include at least one ceramic powder of the following ceramic powders: aluminum oxide, magnesium oxide, titanium oxide, zirconia, iron oxide, copper oxide, nickel oxide, cobalt oxide, lithium oxide, zinc oxide, or silicon dioxide.

10. The vehicle-mounted control device according to claim 9 ,

wherein the at least one ceramic powder has a mean particle size between 0.01 micrometers (μm) and 200 micrometers (μm).

11. The vehicle-mounted control device according to claim 1 ,

wherein the organic resin being used is a synthetic resin or an aqueous emulsion resin.

12. The vehicle-mounted control device according to claim 11 ,

wherein the synthetic resin is any of the group consisting of phenol resin, alkyd resin, melamine urea resin, epoxy resin, polyurethane resin, silicone resin, vinyl acetate resin, acrylic resin, chlorinated rubber resin, vinyl chloride resin, and fluororesin.

13. The vehicle-mounted control device according to claim 11 ,

wherein the aqueous emulsion resin is any of the group consisting of silicone acrylic emulsion, urethane emulsion, and acrylic emulsion.

14. The vehicle-mounted control device according to claim 1 ,

wherein a film thickness of each of the heat radiating coating layers is between 1 micrometer (μm) and 200 micrometers (μm).

15. The vehicle-mounted control device according to claim 1 ,

wherein a film thickness of each of the heat radiating coating layers is between 20 micrometers (μm) and 40 micrometers (μm).

16. The vehicle-mounted control device according to claim 1 ,

wherein the base is between the second heat radiating coating layer and a heat source, without the first heat radiating coating layer between the second heat radiating coating layer and the heat source.

Assignments (2)
CHANGE OF NAME Recorded Sep 2, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 057655/0824 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 24, 2015
From: ITO, MAKI; ISHII, TOSHIAKI; KAMOSHIDA, MASARU; YOSHINARI, HIDETO; SAITO, MASATO; KONNO, AKITOYO
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 037133/0960 →
Priority Claims (1)
JP JP2013-126387 · Jun 17, 2013 · national
Continuity (1)
Related Publication 20160106010A1 · Apr 14, 2016