IP Library Granted Patent US 10,511,158
Granted Patent B2
US 10,511,158 · App. 14/899,325 · Granted Dec 17, 2019

Method for producing a multiplicity of surge arresters in an assembly, surge arrester and surge arrester assembly

Inventors: Robert Hoffmann (Berlin, DE); Frank Werner (Berlin, DE)
Assignee: EPCOS AG
H02H1/04H01T21/00H02H9/06
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Quick Facts
Patent No.
US 10,511,158
App. No.
14/899,325
Granted
Dec 17, 2019
Kind
B2
Abstract

A method is provided for manufacturing a plurality of arresters as a composite structure. A ceramic carrier having a plurality of holes and two electrode bodies are provided. The ceramic carrier and the two electrode bodies are assembled into a base under gas atmosphere. The ceramic carrier is located between the electrode bodies. The electrode bodies are soldered to the ceramic carrier. The base body is separated into a plurality of gas-filled arresters is carried out. In addition, a gas-filled arrester is provided which has a height of maximal 2 mm and electrode surfaces of maximal 1.2×1.2 mm 2 .

Claims (30)

1. A method for manufacturing a plurality of arresters, the method comprising:

providing a ceramic carrier having a plurality of holes;

providing first and second electrode bodies, wherein each of the first and second electrode bodies comprise a plurality of protuberances;

assembling the ceramic carrier and the first and second electrode bodies under a gas atmosphere into a base body, wherein the ceramic carrier is located between the first and second electrode bodies such that the protuberances engage with and extend into the holes of the ceramic carrier;

soldering the first and second electrode body to the ceramic carrier; and

separating the base body into a plurality of gas-filled arresters.

2. The method according to claim 1 , wherein gas-filled hollow spaces are formed in the holes of the ceramic carrier when assembling the ceramic carrier and the first and second electrode bodies into the base body.

3. The method according to claim 1 , wherein, before soldering the base body, a solder layer is arranged between the ceramic carrier and each of the first and second electrode bodies.

4. The method according to claim 3 , wherein the solder layer is a solder foil.

5. The method according to claim 3 , wherein gas-filled hollow spaces are formed in the holes of the ceramic carrier when assembling the ceramic carrier and the first and second electrode bodies into the base body and wherein the gas-filled hollow spaces are sealed via solder when soldering the base body.

6. The method according to claim 1 , wherein separating the base body comprises sawing, water jet cutting, or laser cutting.

7. The method according to claim 1 , wherein the gas atmosphere contains noble gases or hydrogen.

8. The method according to claim 1 , wherein the ceramic carrier includes a matrix made up of 15×15 holes.

9. The method according to claim 1 , wherein each of the gas-filled arresters has a height of at most 2 mm and electrode surfaces of at most 1.2×1.2 mm 2 .

10. The method according to claim 1 , wherein each protuberance is conical, cylinder-shaped or dome-shaped.

11. A method of making an arrester composite structure comprising a plurality of gas-filled arresters manufactured according to the method of claim 1 .

12. The method according to claim 1 , wherein the thickness of each electrode body at the protuberances is greater than the thickness of that electrode body adjacent to the protuberances.

13. The method according to claim 1 , wherein the thickness of each electrode body at the protuberances is greater than the thickness of that electrode body adjacent to the protuberances.

14. A method for manufacturing a plurality of arresters, the method comprising:

providing a ceramic carrier having a plurality of holes;

providing first and second electrode bodies, wherein each of the electrode bodies comprises a plurality of protuberances;

providing two solder foils, each solder foil having a plurality of holes, the two solder foils being provided separately from the ceramic carrier and from the second electrode bodies;

assembling the ceramic carrier, the solder foils and the first and second electrode bodies under a gas atmosphere into a base body such that the ceramic carrier is located between the solder foils such that the holes of the solder foils match with the holes of the ceramic carrier and wherein the ceramic carrier and the solder foils are located between the first and second electrode bodies such that the protuberances engage with and extend into the holes of the ceramic carrier and the holes of one of the solder foils;

soldering the first and second electrode body to the ceramic carrier; and

separating the base body into a plurality of gas-filled arresters.

15. The method of claim 14 , wherein each of the plurality of gas-filled arresters has a height of at most 2 mm and electrode surfaces of at most 1.2×1.2 mm 2 .

16. The method of claim 14 , wherein separating the base body comprises sawing, water jet cutting, or laser cutting.

17. The method of claim 14 , wherein the gas atmosphere contains noble gases or hydrogen.

18. The method of claim 14 , wherein the ceramic carrier includes a matrix made up of 15×15 holes.

19. The method of claim 14 , wherein the protuberances are conical, cylinder-shaped or dome-shaped.

Assignments (2)
CHANGE OF NAME Recorded Mar 15, 2023
From: EPCOS AG
To: TDK ELECTRONICS AG
Reel/Frame 063101/0709 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2016
From: HOFFMANN, ROBERT; WERNER, FRANK, DR.
To: EPCOS AG
Reel/Frame 037657/0375 →
Priority Claims (1)
DE 10 2013 012 842 · Aug 2, 2013 · national
Continuity (1)
Related Publication 20160141858A1 · May 19, 2016