Formulations comprising hydridosilanes and hydridosilane oligomers, their process of manufacture and their use

1. A formulation, comprising:

at least one hydridosilane and at least one hydridosilane oligomer,

wherein the at least one hydridosilane has the formula Si n H 2n+2 with n =3-6, and

wherein a proportion of the at least one hydridosilane is 0.1 to 60% by weight and a proportion of the at least one hydridosilane oligomer is from 40 to 99.9% by weight, each based on the total mass of the at least one hydridosilane and the at least one hydridosilane oligomer present in the formulation,

wherein said at least one hydridosilane oligomer has a weight-average molecular weight of 200 g/mol to 10,000 g/mol.

2. The formulation according to claim 1 , wherein said at least one hydridosilane is selected from the group consisting of trisilane, isotetrasilane, n-pentasilane, 2-silyltetrasilane and neopentasilane.

3. The formulation according to claim 1 , wherein said at least one hydridosilane is a branched hydridosilane.

4. The formulation according to claim 1 said at least one hydridosilane oligomer is obtained by oligomerization of noncyclic hydridosilanes.

5. The formulation according to claim 4 , wherein said at least one hydridosilane oligomer is obtained by thermal conversion of a composition comprising at least one noncyclic hydridosilane comprising not more than 20 silicon atoms in the absence of a catalyst at a temperature of less than 235° C.

6. The formulation according to claim 1 wherein said at least one hydridosilane oligomer comprises carbon.

7. The formulation according to claim 1 , wherein said at least one hydridosilane oligomer is doped.

8. The formulation according to claim 1 , wherein a proportion of the at least one hydridosilane is from 1% to 50% by weight based on the total mass of the formulation.

9. The formulation according to claim 1 , wherein a proportion of the at least one hydridosilane oligomer is from 1% to 50% by weight based on the total mass of the formulation.

10. The formulation according to claim 1 , further comprising at least one solvent.

11. The formulation according to claim 10 , wherein a proportion of the at least one solvent is from 25% to 95% by weight based on the total mass of the formulation.

12. The formulation according to claim 10 , comprising 1-30% by weight of the at least one hydridosilane, 1-20% by weight of the at least one hydridosilane oligomer and 60-95% by weight of the at least one solvent, based on the total mass of the formulation.

13. A process for preparing a formulation according to claim 1 , comprising:

mixing the at least one hydridosilane with the at least one hydridosilane oligomer and optionally a solvent.

14. A process for producing a silicon-containing layer, comprising: applying the formulation according to claim 1 to a substrate.

15. A process for producing an electronic layer or an optoelectronic layer, comprising: applying the formulation according to claim 1 to a substrate.

16. A process for producing an electronic component or an optoelectronic component, comprising:

applying the formulation according to claim 1 to a substrate in the electronic component or the optoelectronic component.

17. The formulation of claim 1 , wherein the proportion of the at least one hydridosilane oligomer, based on the total mass of the at least one hydridosilane and the at least one hydridosilane oligomer present in the formulation, is from 60 to 99% by weight.

18. The formulation of claim 1 , wherein the proportion of the at least one hydridosilane oligomer, based on the total mass of the at least one hydridosilane and the at least one hydridosilane oligomer present in the formulation, is from 70 to 90% by weight.

19. The formulation of claim 1 , wherein the formulation is capable of application to a substrate and subsequent formation of a layer without blisters.