LED device
Provided is an LED device presenting minimal risk of bottom-surface contamination even when foreign substances such as liquids adhere thereto. The LED device has an LED die, a submount substrate on the surface of which the LED die is mounted, a frame-shaped electrode disposed along the outer circumferential part of the bottom surface of the submount substrate, and an inner-side electrode surrounded by the frame-shaped electrode and connected to the electrode of the LED die. In the LED device, the frame-shaped electrode is disposed along the entire outer circumferential part of the bottom surface. In an LED device, the bottom surface is rectangular, and the frame-shaped electrode is disposed along three sides of the bottom surface.
1. An LED device comprising:
one or more LED dies which have a first electrode and a second electrode;
a submount substrate having a top surface on which the one or more LED dies are mounted and a bottom surface;
a frame-shaped electrode that is arranged along the periphery of the bottom surface of the submount substrate, and electrically connected to the first electrode or electrically connected to neither the first electrode nor the second electrode; and
one or more inside electrodes that are surrounded by the frame-shaped electrode and which are connected to at least one of the first electrode and the second electrode, wherein
the shape of the bottom surface of the submount substrate is rectangular,
the frame-shaped electrode is arranged along only a first side of the bottom surface of the substrate, a second side of the bottom surface of the substrate in a direction perpendicular to the first side of the bottom surface of the substrate, and a third side of the bottom surface of the substrate in the direction parallel to the first side of the bottom surface of the submount substrate, and the frame-shaped electrode has a first portion arranged along the first side of the bottom surface of the substrate, a second portion arranged along the second side of the bottom surface of the substrate, a third portion arranged along the third side, and is not arranged along the fourth side of the bottom surface of the submount substrate in the direction parallel to the second side of the bottom surface of the substrate, and
both ends of the first portion and third portion of the frame-shaped electrode facing the fourth side of the bottom surface of the substrate touch the fourth side of the bottom surface of the substrate.
2. The LED device according to claim 1 , wherein
the frame-shaped electrode is connected to a ground wire that is formed on a mother substrate on which the LED device is mounted.
3. The LED device according to claim 1 , wherein
the one or more LED dies are a red light-emitting LED die, a green light-emitting LED die, and a blue light-emitting LED die.
4. The LED device according to claim 1 , wherein the frame-shaped electrode is connected to the first electrode of the one or more LED dies.