Preparation method for power diode
A preparation method for a power diode, comprising: providing a substrate ( 10 ), the substrate ( 10 ) having a front surface and a back surface opposite to the front surface, an N-type layer ( 20 ) growing on the front surface of the substrate ( 10 ), and the N-type layer ( 20 ) having a first surface deviating from the substrate ( 10 ); forming a terminal protection ring ( 31, 32, 33 ); forming an oxide layer ( 50 ), and performing knot pushing on the terminal protection ring ( 31, 32, 33 ); conducting photoetching using a photoetching plate of an active region and etching the oxidation layer ( 50 ) of the active region, and forming a gate oxide layer ( 60 ) on the first surface of the N-type layer ( 20 ) of the active region; depositing on the gate oxide layer ( 60 ) to form a polysilicon layer ( 70 ); conducting photoetching using a polysilicon photoetching plate, taking a photoresist ( 40 ) as a mask layer to inject P-type ions into the N-type layer ( 20 ), and forming a P-type body region ( 82 ) beneath the polysilicon layer ( 70 ) through ion scattering; forming an N-type heavily doped region; forming a P+region; conducting thermal annealing, activating injected impurities and removing the photoresist ( 40 ); and conducting metallization processing on the first surface and the back surface of the substrate ( 10 ).
1. A method of manufacturing a power diode, comprising the following steps:
providing a substrate comprising a front side and a back side opposite to the front side;
and growing an N-type layer on the front side of the substrate, wherein the N-type layer comprises a first surface away from the substrate;
forming a terminal guard ring on the first surface of the N-type layer;
forming an oxide layer on the first surface of the N-type layer, and performing a driving-in to the terminal guard ring;
performing photoetching by using an active region photomask and etching the oxide layer on an active region area, and forming a gate oxide layer on the first surface of the N-type layer on the active region area;
depositing a polysilicon layer on the gate oxide layer;
performing photoetching by using a polysilicon photomask, implanting P-type ions into the N-type layer by using a photoresist as a masking layer, and forming a P-type body region below the polysilicon layer via ion scattering;
etching the polysilicon layer by using the photoresist as the masking layer, implanting N-type ions into the P-type body region below the etched area, and forming an N-type heavily doped region;
performing gate oxide layer etching and then silicon etching by using the photoresist as the masking layer, implanting P-type ions below the etched area via ion implantation, and forming a P+ region;
performing thermal annealing, activating the implanted impurities and removing the photoresist; and
performing metallization processing on the first surface and the back side of the substrate.
2. The method of manufacturing the power diode of claim 1 , wherein the forming the terminal guard ring on the first surface of the N-type layer comprises:
forming a thin pad oxide layer on the first surface of the N-type layer, performing photoetching by using the terminal guard ring photomask, implanting P-type ions into the N-type layer by using the photoresist as the masking layer, and forming a P-type terminal guard ring below the thin pad oxide layer.
3. The method of manufacturing the power diode of claim 1 , wherein in the performing gate oxide layer etching and then silicon etching by using the photoresist as the masking layer, implanting P-type ions below the etched area via ion implantation, and forming the P+ region, a thickness of the etched and removed silicon is 0.15 μm to 0.3 μm.
4. The method of manufacturing the power diode of claim 1 , wherein in the performing photoetching by using the polysilicon photomask, implanting P-type ions into the N-type layer by using the photoresist as the masking layer, and forming the P-type body region below the polysilicon layer via ion scattering, the P-type ions are boron ions; in the etching the polysilicon layer by using the photoresist as the masking layer, implanting N-type ions into the P-type body region below the etched area, and forming the N-type heavily doped region, the N-type ions are As ions; and in the step of performing gate oxide layer etching and then silicon etching by using the photoresist as the masking layer, implanting P-type ions below the etched area via ion implantation, and forming the P+ region, the P-type ions comprise boron ions and BF 2 ions.
5. The method of manufacturing the power diode of claim 4 , wherein in the performing photoetching by using the polysilicon photomask, implanting P-type ions into the N-type layer by using the photoresist as the masking layer, and forming the P-type body region below the polysilicon layer via ion scattering, an implantation energy of the boron ions is 30 KeV to 50 KeV, and a sum of implantation dose of the boron ions is 1×10 13 cm −2 to 5×10 13 cm −2 ; in the step of etching the polysilicon layer by using the photoresist as the masking layer, implanting N-type ions into the P-type body region below the etched area, and forming the N-type heavily doped region, an implantation energy of the As ions is 30 KeV to 50 KeV, and a sum of implantation dose of the As ions is 1×10 15 cm −2 to 1×10 16 cm −2 ; and in the step of performing gate oxide layer etching and then silicon etching by using the photoresist as the masking layer, implanting P-type ions below the etched area via ion implantation, and forming the P+ region, an implantation energy of the boron ions is 80 KeV to 100 KeV, and a sum of implantation dose of the boron ions is 1×10 13 cm −2 to 5×10 13 cm −2 , while an implantation energy of the BF 2 ions is 20 KeV to 40 KeV, and a sum of implantation dose of the BF 2 ions is 6×10 14 cm −2 to 1×10 15 cm −2 .
6. The method of manufacturing the power diode of claim 1 , wherein in the performing photoetching by using the polysilicon photomask, implanting P-type ions into the N-type layer by using the photoresist as the masking layer, and forming the P-type body region below the polysilicon layer via ion scattering, the P-type ions are implanted in plural steps.
7. The method of manufacturing the power diode of claim 1 , wherein the driving-in is performed in an oxygen-free environment at a temperature of less than or equal to 1100° C., and a driving-in time is 60 minutes to 200 minutes.
8. The method of manufacturing the power diode of claim 1 , wherein a thickness of the polysilicon layer is 800 angstrom to 6000 angstrom.
9. The method of manufacturing the power diode of claim 1 , wherein a thickness of the N-type layer is 3 μm to 20 μm, and a resistivity of the N-type layer is 0.5Ω·cm to 10Ω·cm.
10. The method of manufacturing the power diode of claim 1 , wherein the substrate is an N-type silicon wafer with an orientation of 100.