Organic light-emitting component having organic light-emitting diode integrally connected to circuit board

1. An organic light-emitting component comprising:

an organic light-emitting diode comprising an organic layer configured to generate light and having a covering body disposed over an electrode and the organic layer with the electrode disposed between the covering body and the organic layer; and

a circuit board having electrical conductor tracks and a metallic layer disposed on a first side of the circuit board, wherein at least one of the conductor tracks is electrically conductively connected to the metallic layer;

wherein an electrical conductor track of the circuit board is electrically conductively connected to the organic layer of the organic light-emitting diode through the metallic layer;

wherein the circuit board is electrically contactable from a second side remote from the organic light-emitting diode and opposite the first side;

wherein the circuit board is arranged on the organic light-emitting diode with the metallic layer disposed on, and in contact with, the covering body;

wherein a component of the organic light-emitting diode forms an electrically insulating base body of the circuit board; and

wherein the electrically insulating base body is formed at least partly by the covering body of the organic light-emitting diode.

2. The organic light-emitting component according to claim 1 , wherein the circuit board comprises a first layer and a second layer that each comprise an electrically insulating material and are arranged one above the other in a vertical direction perpendicular to a plane of main extent of the organic light-emitting diode, a conductor track of the electrical conductor tracks being arranged in each of the first and second layers.

3. The organic light-emitting component according to claim 2 , wherein the electrically insulating material of the first and second layers and the conductor tracks have been applied to the organic light-emitting diode by printing processes.

4. The organic light-emitting component according to claim 1 , wherein the circuit board is electrically conductively connected to the organic layer by way of a via that extends into the organic light-emitting diode.

5. The organic light-emitting component according to claim 1 , further comprising an electronic component arranged on an upper side of the circuit board remote from the organic light-emitting diode, wherein the electronic component is electrically conductively connected to a conductor track of the electrical conductor tracks of the circuit board.

6. The organic light-emitting component according to claim 1 , wherein the electrically insulating base body is formed at least partly by a thin-film encapsulation of the organic light-emitting diode.

7. The organic light-emitting component according to claim 1 , wherein the electrically insulating base body is at least partly formed by a thin-film encapsulation of the organic light-emitting diode;

wherein the circuit board is electrically conductively connected to the organic layer by a via that extends into the organic light-emitting diode; and

wherein the via passes through the thin-film encapsulation of the organic light-emitting diode.

8. A method of producing an organic light-emitting component, the method comprising:

providing an organic light-emitting diode having an organic layer configured to generate light and further having an outer layer over the organic layer and an electrode that is disposed between the outer layer and the organic layer, wherein the outer layer is one of a thin-film encapsulation or a covering body; and

forming a circuit board having electrical conductor tracks, wherein the circuit board is created on the organic light-emitting diode and is integrally connected to the organic light-emitting diode with a first side of the circuit board attached to the organic light emitting diode;

forming a via through the circuit board and extending from a second side of the circuit board remote from the first side, through the circuit board and through the outer layer to the electrode such that the via contacts the electrode;

wherein an electrical conductor track of the circuit board is electrically conductively connected to the organic layer of the organic light-emitting diode;

wherein the circuit board is electrically contactable from a side remote from the organic light-emitting diode; and

wherein the circuit board at no time of the method being present as a separate component, but being produced directly on the organic light-emitting diode.

9. The method according to claim 8 , wherein, owing to the integral connection, the circuit board and the organic light-emitting diode cannot be non-destructively detached from one another.

10. The method according to claim 8 , wherein a component of the organic light-emitting diode forms an electrically insulating base body of the circuit board, the electrically insulating base body being formed at least partly by a thin-film encapsulation of the organic light-emitting diode.

11. The method according to claim 8 , wherein a component of the organic light-emitting diode forms an electrically insulating base body of the circuit board, the electrically insulating base body being formed at least partly by a covering body of the organic light-emitting diode.