Etching agent, etching method and etching agent preparation liquid
View Patent ↗The object of the present invention is to provide: an etching agent for a titanium-based metal on a semiconductor substrate, which suppresses decomposition of hydrogen peroxide, has a long liquid service life, and has less need for controlling the concentration of hydrogen peroxide in the etching agent, even in the cases where the etching agent is used for a semiconductor substrate having the titanium-based metal and a metallic copper or a metal alloy; an etching method; and an etching agent preparation liquid for use by mixing with hydrogen peroxide. The present invention relates to: an etching agent for a titanium-based metal on a semiconductor substrate, having a titanium-based metal and a metallic copper or a copper alloy on the upper part of the titanium-based metal, comprising an aqueous solution containing at least (A) hydrogen peroxide, (B) phosphonic acid-based chelating agent having a nitrogen atom in the structure, (C) alkali metal hydroxide, and (D) organic acid having at least one hydroxyl group and at least three carboxyl groups; an etching method, which comprises using the etching agent; and an etching agent preparation liquid for use by mixing with hydrogen peroxide.
1. An etching agent for a titanium-based metal on a semiconductor substrate, having a titanium-based metal and a metallic copper or a copper alloy on the upper part of said titanium-based metal, comprising an aqueous solution containing at least the following (A), (B), (C) and (D):
(A) hydrogen peroxide;
(B) diethylenetriamine penta(methylenephosphonic acid);
(C) potassium hydroxide;
(D) citric acid.
2. The etching agent according to claim 1 , wherein a pH range of the etching agent is 7 to 10.
3. The etching agent according to claim 1 , wherein contained amount of (A) hydrogen peroxide is 10 to 33% by weight, contained amount of (B) diethylenetriamine penta(methylenephosphonic acid) is 0.05 to 5% by weight, contained amount of (C) potassium hydroxide is 0.2 to 5% by weight, and contained amount of (D) citric acid is 0.01 to 5% by weight.
4. The etching agent according to claim 1 , wherein the aqueous solution substantially consists of (A), (B), (C) and (D).
5. The etching agent according to claim 1 , wherein the etching agent is prepared from a solution containing (A) hydrogen peroxide and an etching agent preparation liquid, which comprises an aqueous solution containing (B) diethylenetriamine penta(methylenephosphonic acid), (C) potassium hydroxide and (D) citric acid.
6. The etching agent according to claim 1 , wherein the etching agent are prepared by mixing a solution containing 20 to 35% by weight of (A) hydrogen peroxide, and an etching agent preparation liquid, which comprises an aqueous solution containing 1 to 10% by weight of (B) diethylenetriamine penta(methylenephosphonic acid), 4 to 10% by weight of (C) potassium hydroxide and 0.2 to 10% by weight of (D) citric acid, in a mixing ratio of 50:50 to 95:5, on weight ratio basis.
7. An etching agent preparation liquid for preparing an etching agent for a titanium-based metal on a semiconductor substrate, having a titanium-based metal and a metallic copper or a copper alloy on the upper part of said titanium-based metal, comprising an aqueous solution containing at least the following (B), (C) and (D), and being the one for mixing with a solution containing (A) hydrogen peroxide:
(B) diethylenetriamine penta(methylenephosphonic acid);
(C) potassium hydroxide;
(D) citric acid.
8. The etching agent preparation liquid according to claim 7 , wherein contained amount of (B) diethylenetriamine penta(methylenephosphonic acid) is 1 to 10% by weight, contained amount of (C) potassium hydroxide is 4 to 10% by weight, and contained amount of (D) citric acid is 0.2 to 10% by weight.
9. The etching agent preparation liquid according to claim 8 , wherein the etching agent preparation liquid is used to prepare the etching agent, by mixing with a solution containing 20 to 35% by weight of (A) hydrogen peroxide.
10. The etching agent preparation liquid according to claim 9 , wherein a mixing ratio of the solution containing (A) hydrogen peroxide and the etching agent preparation liquid is 50:50 to 90:5, on weight ratio basis.