Method of manufacturing a conductive substrate
Provided are a conducting substrate and a method for preparing the same. The method for preparing the conducting substrate according to an embodiment of the present application includes a) providing a substrate comprising a conducting layer; b) forming a metal layer on the entire surface of the substrate comprising the conducting layer; c) forming an insulating layer pattern on the metal layer; d) forming a metal layer pattern by over-etching the metal layer by using the insulating layer pattern as a mask; and e) reforming the insulating layer pattern.
1. A method for preparing a conducting substrate, comprising:
a) forming a conducting layer on a substrate and patterning the conducting layer;
b) forming a metal layer on the entire surface of the substrate and the patterned conducting layer;
c) forming an insulating layer pattern on the metal layer;
d) forming a metal layer pattern by over-etching the metal layer by using the insulating layer pattern as a mask; and
e) reforming the insulating layer pattern to cover the metal layer pattern,
wherein, the insulating layer pattern has mobility, and
in the step of reforming the insulating layer pattern, the shape of the insulating layer pattern changes, and the insulating layer pattern reflows while the shape thereof is changed to contact the side of the metal layer pattern to thereby insulate the metal layer pattern from the outside.
2. The method of claim 1 , wherein the conducting layer comprises a transparent conducting oxide.
3. The method of claim 2 , wherein the transparent conducting oxide is an oxide including one or more selected from indium (In), tin (Sn), zinc (Zn), gallium (Ga), cerium (Ce), cadmium (Cd), magnesium (Mg), beryllium (Be), silver (Ag), molybdenum (Mo), vanadium (V), copper (Cu), iridium (Ir), rhodium (Rh), ruthenium (Ru), tungsten (W), cobalt (Co), nickel (Ni), manganese (Mn), aluminum (Al), and lanthanum (La).
4. The method of claim 1 , wherein the metal layer is a single layer or a multilayer including silver, aluminum, copper, neodymium, molybdenum, chromium, or an alloy thereof.
5. The method of claim 1 , wherein the method of forming the insulating layer pattern uses a printing method, a photolithography method, a photography method, a method using a mask, or laser transfer.
6. The method of claim 1 , wherein a taper angle of the insulating layer pattern is more than 0° and less than 90°, and
the taper angle is an angle between an end of the insulating layer pattern and a surface of the metal layer.
7. The method of claim 1 , wherein during an over-etching process of the metal layer, an undercut is formed below the edge of the insulating layer pattern.
8. The method of claim 1 , wherein at the end of the patterned conducting layer, at least a part of the insulating layer pattern is formed to contact the substrate.