Injection-molding apparatuses containing integrally formed thermocouples
View Patent ↗Thermocouples and their associated thermocouple junctions can be integrated via freeform fabrication into various parts of injection-molding apparatuses, including the nozzles. Unitary monolithic integration of thermocouples allows thermocouple junctions to be located highly proximate to the locations where temperature monitoring is desired, particularly, near the tips of injection-molding nozzles, which has conventionally been difficult or impossible to achieve. An injection-molding nozzle with one or more integrated thermocouples, a hot-runner manifold with injection-molding nozzles, having integrated thermocouples, monolithically integrated with the manifold as a single part using a freeform fabrication process, and a separately formed injection-molding nozzle having at least one integrated thermocouple and a robust electrical connection are presented according to various aspects of the invention.
1. An injection-molding apparatus, comprising:
a nozzle including a nozzle body manufactured using one or more freeform fabrication processes so as to make said nozzle body unitary monolithic, said nozzle body defining a gate engagement plane for engaging a gate of a mold, and further comprising:
at least one melt channel;
a nozzle tip comprising an outlet orifice in fluid communication with said at least one melt channel;
a thermocouple integrally formed using a freeform fabrication process within and as part of said unitary-monolithic nozzle body, said-thermocouple further comprising a thermocouple junction located within said nozzle tip, downstream of the gate engagement plane and proximate to said at least one melt channel and said outlet orifice; and
wherein, the freeform fabrication process is at least one of:
(a) electron beam melting;
(b) electron beam freeform fabrication
(c) laser-engineered net shaping
(d) poly jet matrix
(e) selective laser sintering, and
(f) shape deposition manufacturing.
2. The injection-molding apparatus according to claim 1 , wherein said thermocouple junction is encased within a dielectric material formed unitary-monolithically within said nozzle tip.
3. The injection-molding apparatus according to claim 2 , wherein said thermocouple further includes a pair of electrical conductors extending from said thermocouple junction and formed unitary-monolithically with said nozzle body.
4. The injection-molding apparatus according to claim 3 , wherein said pair of electrical conductors are encased within said dielectric material.
5. The injection-molding apparatus according to claim 4 , wherein said pair of electrical conductors are encased together within said dielectric material.
6. The injection-molding apparatus according to claim 4 , wherein said pair of electrical conductors are encased separately within said dielectric material so as to be separated in part by a portion of said nozzle body.
7. The injection-molding apparatus according to claim 3 , further including a pair of external electrical contacts formed unitary-monolithically with said nozzle body, said pair of external electrical contacts electrically connected correspondingly respectively to said pair of electrical conductors.
8. The injection-molding apparatus according to claim 1 , further comprising a hot-runner manifold manufactured using one or more freeform fabrication processes so as to make said hot-runner manifold unitary monolithic with said nozzle body.
9. The injection-molding apparatus according to claim 8 , wherein said thermocouple junction is encased within a dielectric material formed unitary-monolithically within said nozzle tip.
10. The injection-molding apparatus according to claim 9 , wherein said thermocouple further includes a pair of electrical conductors extending from said thermocouple junction and formed unitary-monolithically with each of said nozzle body and said hot-runner manifold.
11. The injection-molding apparatus according to claim 10 , wherein said pair of electrical conductors are encased within said dielectric material.
12. The injection-molding apparatus according to claim 11 , wherein said pair of electrical conductors are encased together within said dielectric material.
13. The injection-molding apparatus according to claim 11 , wherein said pair of electrical conductors are encased separately within said dielectric material so as to be separated in part by a portion of said nozzle body.
14. The injection-molding apparatus according to claim 10 , further including a pair of external electrical contacts formed unitary-monolithically with said hot-runner manifold, said pair of external electrical contacts electrically connected correspondingly respectively to said pair of electrical conductors.