Semiconductor device
View Patent ↗A semiconductor device includes a semiconductor element having a front surface and a rear surface, a pair of heat sinks disposed facing each other so as to sandwich the semiconductor element, and attached respectively to the front surface and the rear surface, and a fastening screw fastening the pair of the heat sinks in the facing direction, the fastening screw having insulation property. Threads are arranged on at least a part of the fastening screw in an axis direction of the fastening screw between the pair of the heat sinks.
1. A semiconductor device comprising:
a semiconductor element having a front surface and a rear surface;
a pair of heat sinks disposed facing each other so as to sandwich the semiconductor element, and attached respectively to the front surface and the rear surface; and
a fastening screw fastening the pair of the heat sinks in the facing direction, the fastening screw having insulation property;
wherein
threads are arranged on at least a part of the fastening screw in an axis direction of the fastening screw between the pair of the heat sinks, and
sealing resin is filled between the pair of the heat sinks, the sealing resin being in close contact with the threads of the fastening screw.